Enhanced heat-resistant PA66 composite
A technology of PA66 and composite materials, applied in the field of reinforced heat-resistant PA66 composite materials, can solve the problems of the heat resistance and impact strength of PA66 composite materials need to be further improved, and achieve the effect of increasing heat resistance
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Embodiment 1
[0012] 60 parts of PA66, 5 parts of silicon carbide whiskers, 0.6 parts of pentaerythritol tetrastearate, 0.1 parts of N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, tetrakis[β-(3,5 - 0.1 part of di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester.
[0013] The preparation method of the present invention: according to the above mass ratio, uniformly mix PA66 after vacuum drying with silicon carbide whiskers, pentaerythritol tetrastearate, coupling agent and antioxidant to obtain a mixed material, the mixing temperature is 40°C, and then The mixed material is extruded and granulated by twin-screw, and the temperature of each section of the extruder is controlled at 250°C. The product performance is shown in Table 1.
[0014]
Embodiment 2
[0016] 80 parts of PA66, 8 parts of silicon carbide whiskers, 0.8 parts of pentaerythritol tetrastearate, 0.2 parts of γ-methacryloxypropyl trimethoxysilane, tetrakis[β-(3,5-di-tert-butyl 0.3 parts of -4-hydroxyphenyl) propionate] pentaerythritol ester.
[0017] The preparation method of the present invention: according to the above mass ratio, the vacuum-dried PA66, silicon carbide whiskers, pentaerythritol tetrastearate, coupling agent and antioxidant are uniformly mixed to obtain a mixed material, and the mixing temperature is 50 ° C. The mixed material is extruded and granulated by twin-screw, and the temperature of each section of the extruder is controlled at 270°C. The product performance is shown in Table 1.
[0018]
Embodiment 3
[0020] 70 parts of PA66, 6 parts of silicon carbide whiskers, 0.7 parts of pentaerythritol tetrastearate, 0.15 parts of tetraisopropyl bis(dioctylphosphite acyloxy) titanate, tris[2.4-di-tert-butylbenzene Base] phosphite 0.2 part.
[0021] The preparation method of the present invention: according to the above-mentioned mass ratio, the PA66 after vacuum drying, silicon carbide whiskers, pentaerythritol tetrastearate, coupling agent and antioxidant are uniformly mixed to obtain a mixed material, the mixing temperature is 45 °C, and then The mixed material is extruded and granulated by twin-screw, and the temperature of each section of the extruder is controlled at 260°C. The product performance is shown in Table 1.
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