Micro-bending-coining automation device and method of sheet metal under indirect impact of laser

Abstract

The invention discloses a micro-bending-coining automation device and method of a sheet metal under indirect impact of laser. The micro-bending-coining automation device comprises a laser generating system, an automatic forming system and a control system, wherein the laser generating system is composed of a laser controller, a laser emitter and an optical fiber, and the automatic forming system is composed of an end cap, a focusing lens cone, a machine body, a micro-bending-coining worktable, a three-coordinate moving chuck, a varying magnetic field device, a rotary table multi-position device, a restrain layer-fly piece integrated piece, a restraint layer-fly piece integrated piece storage bin and a recovery device. According to the micro-bending-coining automation device and method of the sheet metal under the indirect impact of the laser, pulse laser is used as a forming power source, energy conversion between optical energy and mechanical energy is conducted through a restraint layer-fly piece integrated piece device, and therefore automation of the micro-bending-coining technology of a fly piece loading sheet metal driven by the pulse laser is achieved. The automatic forming system is relatively independent, the machining precision is free from external interference, and personal errors are avoided. Both laser circuits and the micro-bending coining worktable are stored inside the machine body so that safety of experimental operation is improved.

Description

technical field [0001] The invention relates to an automatic device and method for micro-bending and embossing of a thin metal plate under indirect laser impact, which belongs to the field of advanced forming of mechanical manufacturing and the field of automatic processing, especially the technical field of micro-electromechanical system (MEMS) parts processing. Background technique [0002] With the rapid development of modern science and technology, and with the continuous improvement of market requirements for technological products, in fields such as aerospace, precision instruments, and biomedicine, the application of micro-devices is becoming more and more extensive, and the demand for micro-components of various materials are increasing, thus promoting a new exploration of the processing technology of micro devices. [0003] Today's MEMS-oriented micromachining technology and technology are developed on the basis of integrated circuits, mainly relying on LIGA, etchin...

AI Technical Summary

Problems solved by technology

However, the current laser-driven flyer micro-bending-imprinting technology device cannot continuously pulse laser-driven flyer micro-bending-imprinting, and its mass production is only the formation of multiple dies under the impact of one pulse, not in the true sense. Rapid and continuous batch production, and because the workpiece and fixture need to be re-clamped after a laser shock forming in this device and method, it is bound to bring human error due to manual operation and affect the processing accuracy

Moreover, the open laser light path also has certain potential safety hazards

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