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Single-component high-refractivity LED (light-emitting diode) packaging adhesive and preparation method thereof

A technology of LED packaging and high refractive index, which is applied in adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of high brightness and high light efficiency LED packaging, short storage period and service life, and complicated preparation process and other problems, to achieve the effect of easy control, simple operation and easy access to raw materials

Active Publication Date: 2013-08-14
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the hydrosilylation reaction can proceed slowly even at room temperature in the presence of a platinum catalyst, it is necessary to store the catalyst separately from some of the raw materials before the packaging material is used, resulting in the current silicone LED packaging materials on the market Most of them are two-component, the two components need to be fully mixed evenly before potting, and can be used for filling after long-term vacuum degassing, which is troublesome to use and affects production efficiency
However, the existing single-component silicone LED packaging materials still have various disadvantages, such as: low refractive index, unable to meet the needs of high-brightness and high-efficiency LED packaging; short storage period and service life; complex preparation process, difficult to control

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] In this embodiment, the preparation method of the single-component high-refractive index LED encapsulation adhesive includes the following steps in sequence:

[0022] (1) By weight, the following raw materials are equipped: 80 kg of phenyl polysiloxane with vinyl groups (60 kg of which have a viscosity of 12000mPa.s (at a temperature of 25°C), vinyl mass fraction of 5% phenylvinyl MDT silicone resin with a refractive index of 1.54, and the remaining 20 kg is benzene with a viscosity of 1000mPa.s (at a temperature of 25°C), a vinyl mass fraction of 1%, and a refractive index of 1.53. Vinyl silicone oil), 30 kg of crosslinking agent (all are phenylhydrogen silicone oils with a viscosity of 500mPa.s (at a temperature of 25°C), a hydrogen mass fraction of 0.3%, and a refractive index of 1.52), 0.15 kg of platinum catalyst (all are platinum catalysts coated with organosilicon microspheres, and its Pt content is 0.3% (weight)), 0.015 kg of inhibitor (both are 1-phenyl-1-penty...

Embodiment 2

[0026] In this embodiment, the preparation method of the single-component high-refractive index LED encapsulation adhesive includes the following steps in sequence:

[0027](1) By weight, the following raw materials are equipped: 80 kg of phenylpolysiloxane with vinyl groups (50 kg of which have a viscosity of 2000mPa.s (at a temperature of 25°C), and the mass fraction of vinyl groups is 2.2% phenylvinyl silicone oil with a refractive index of 1.54, and the remaining 30 kg is powdered phenylvinyl MQ silicone resin with a vinyl mass fraction of 3% and a refractive index of 1.52. The phenylvinyl MQ silicone resin M / Q=1.4), 25 kg of cross-linking agent (both phenylhydrogen-based silicone oils with a viscosity of 1000mPa.s (at a temperature of 25°C), a hydrogen mass fraction of 0.5%, and a refractive index of 1.52) , 0.1 kg of platinum catalyst (both are platinum complexes coordinated by diethyl phthalate, and the Pt content is 0.5% (weight)), 0.01 kg of inhibitors (both are 1,4-b...

Embodiment 3

[0032] In this embodiment, the preparation method of the single-component high-refractive index LED encapsulation adhesive includes the following steps in sequence:

[0033] (1) By weight, the following raw materials are equipped: 50 kg of phenylpolysiloxane with vinyl groups (20 kg of which have a viscosity of 1500 mPa.s (at a temperature of 25 °C), and the mass fraction of vinyl groups is 4.5% phenylvinyl silicone oil with a refractive index of 1.54; the remaining 30 kg is powdered phenylvinyl MQ silicone resin with a vinyl mass fraction of 5% and a refractive index of 1.54. M / Q=1.7), 35 kg of crosslinking agent (both 2700mPa.s (at a temperature of 25°C), phenylhydrogen-based silicone oil with a mass fraction of hydrogen radicals of 0.4%, and a refractive index of 1.54), platinum Catalyst 0.12 kg (both are platinum catalysts coated with organosilicon microspheres with a Pt content of 0.6% by weight), inhibitors 0.011 kg (both are 1,1-diphenyl-2-propyn-1-ol) ;

[0034] (2) ...

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Abstract

The invention provides a single-component high-refractivity LED (light-emitting diode) packaging adhesive which is prepared from the following raw materials in parts by weight: 50-80 parts of vinyl of phenyl polysiloxane, 25-40 parts of crosslinking agent, 0.1-0.5 part of platinum catalyst, 0.01-0.1 part of inhibitor and 0-5 parts of auxiliary material. The single-component high-refractivity LED packaging adhesive has the advantages of high refractivity, high light transmittance, radiation resistance, high / low temperature resistance, weather resistance and the like; the viscosity of the single-component high-refractivity LED packaging adhesive is 1000-7000 mPa.s, the storage period at normal temperature is 60 days, the storage period at 0-4 DEG C is 6 months, and the hardness after curing is 80A-70D; and the single-component high-refractivity LED packaging adhesive is suitable for packaging protection for high-power high-lighting-effect LEDs. The invention also provides a preparation method of the single-component high-refractivity LED packaging adhesive. The preparation method has the advantages of accessible raw materials, no pollution and mild conditions, and is simple to operate, easy to control and convenient for industrialization.

Description

technical field [0001] The invention relates to packaging materials applied to light-emitting diodes (LEDs), in particular to a single-component high-refractive-index LED packaging glue and a preparation method for the single-component high-refractive-index LED packaging glue. Background technique [0002] In the context of increasingly severe global energy problems and increasing environmental protection requirements, semiconductor LED lighting with long life, energy saving, safety, green environmental protection, rich colors, and miniaturization has been recognized by the world as the third in the history of human lighting after fire and incandescent lamps. A lighting revolution. [0003] Due to the defects of hygroscopicity, easy aging, poor heat resistance, poor UV resistance, and large internal stress after curing, traditional epoxy resin packaging materials can no longer meet the application requirements of mid-to-high-end LED packaging. Silicone LED packaging materia...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/06C09J11/04
CPCC08G77/12C08G77/80C08K5/5419C08K5/56C08L83/04
Inventor 周振基周博轩
Owner NICHE TECH KAISER SHANTOU
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