Preparation method of high-dielectric film

Abstract

The embodiment of the invention discloses a preparation method of a high-dielectric polymer composite film. The preparation method is characterized by comprising the following steps of: sufficiently mixing a main material A and a certain quantity of first solvent to obtain a first slurry; mixing an organic dielectric material B with high dielectric constant and low loss and a certain quantity of second solvent, and dispersing the mixture to obtain a second slurry; sufficiently mixing the first slurry and the second slurry to obtain a third slurry; standing and curing the third slurry in a vacuum container to obtain a uniformly-mixed gel-state high-dielectric organic composite; and adding the gel-state high-dielectric organic composite into an extruding machine for heating and extruding, quenching a molten film through a cooling roller after the molten film is extruded, stretching the extruded cooled film in two ways through a film stretch forming machine, and finally, carrying out heat setting at the temperature of 150 DEG C to obtain the high-dielectric polymer composite film. The film has a high dielectric constant value, a high breakdown voltage value and a low dielectric loss value.

Description

technical field [0001] The invention relates to the technical field of electronic functional materials, in particular to a method for preparing high dielectric polymer composite films. Background technique [0002] Dielectric materials can be used to control / storage charge and electrical energy, and have an important strategic position in modern electronic and power systems. Traditional dielectric materials such as ferroelectric ceramics have high dielectric constants, but are difficult to process into thin films due to their high processing temperature and brittle properties. Polymer dielectric materials have high dielectric breakdown strength, high flexibility, and excellent processing performance, but their dielectric constant values ​​are generally low. [0003] In modern society, with the rapid development of informatization and microelectronics industry, the application requirements for miniaturization, integration, intelligence, high frequency and planarization of co...

AI Technical Summary

Problems solved by technology

Traditional dielectric materials such as ferroelectric ceramics have a high dielectric constant, but their processing temperature is high, brittle and difficult to process into thin films

Polymer dielectric materials have high dielectric breakdown strength, high flexibility, and excellent processing performance, but their dielectric constant values ​​are generally low.

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