Method for making electroformed stencil with positioning points

A production method and positioning point technology, applied in the preparation of the printing surface, the photoplate process of the pattern surface, printing, etc., can solve the problems that the precision and quality of the opening of the steel mold cannot meet the requirements well, and the quality of the board surface is not high enough.

Inactive Publication Date: 2016-12-07
KUN SHAN POWER STENCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the opening accuracy and quality of the steel mold made by traditional technology through laser cutting technology cannot meet the requirements well, and the quality of the board surface is not high enough.

Method used

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  • Method for making electroformed stencil with positioning points
  • Method for making electroformed stencil with positioning points
  • Method for making electroformed stencil with positioning points

Examples

Experimental program
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Effect test

Embodiment

[0053] In order to better align with the PCB accurately and transfer an accurate amount of material to an accurate position, the electroforming process is used to make the electroforming stencil. The process steps include:

[0054] (1) Pre-treatment of the mandrel: degreasing, pickling and sandblasting the mandrel to remove oil stains and impurities on the surface, and smooth the surface;

[0055] (2) Film: apply film to the surface of the mandrel;

[0056] (3) Exposure: Expose the pattern opening area and the hanging hole area in the rectangular area outside the pattern area, so that the unexposed area can be removed by development, and the exposed part is left as a protective film for the subsequent electroforming step;

[0057] (4) Single-sided development: develop the unexposed part in step (3), leaving the exposed part as a protective film for the subsequent electroforming step;

[0058] (5) Electroforming: The electroforming method is used to electroform the electroformin...

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Abstract

The present invention relates to a production method for an electroformed stencil with mark points, including the production of the electroformed stencil and the production of the mark points. The production method is characterized in that the opening pattern area of the electroformed stencil is surrounded by hanging holes arranged in a rectangular area, used to determine the coordinates of the mark points. The production of the mark point comprises the steps of: placing the fixed electroformed stencil on a cutting base platform; then determining the coordinates of the mark points; adjusting cutting parameters and the vertical height of a laser cutting head to enable a laser focus to fall on the surface of the electroformed stencil; emitting laser light through the laser cutting head to perform cutting at the mark point area on the surface of the electroformed stencil. According to the production method for the electroformed stencil with mark points, the obtained electroformed stencil has good surface quality, no pinholes or pittings, thereby improving printing quality; and the mark points have high positioning accuracy, and relatively high degrees of recognition, improving alignment accuracy of a PCB with the electroformed stencil.

Description

technical field [0001] The invention relates to a method for manufacturing a live electroformed stencil, in particular to a method for manufacturing an electroformed stencil with positioning points. Background technique [0002] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The production of the template is not only the first step in the SMT assembly process, but also the most important step. The main function of the stencil is to aid in the deposition of solder paste, transferring the exact amount of material to the exact location on th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41C1/14B41N1/04B41N3/00G03F7/00
Inventor 魏志凌高小平孙倩
Owner KUN SHAN POWER STENCIL
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