A hybrid production process for a step stencil

Abstract

A hybrid production process for a step stencil. The production process flow is as follows: electroforming a first electroformed layer: core mold treatment -> pre-treatment (degreasing, pickling and sandblasting) -> film mounting 1-> film exposure 1-> single sided developing 1-> electroforming 1-> film stripping -> mold stripping; etching a printing surface to form a down step area: printing surface film mounting-> exposure 2-> single sided developing 2 -> etching (forming the down step area on the printing surface); and laser cutting the opening pattern of the down step area: an electroformed stencil with a down step area->laser cutting the opening pattern of the down step area->subsequent processing. By using the production process of the invention, the stencil having the printing surface with the down step area can be produced; the openings of the pattern areas of the substrate and the down step area has good quality, smooth hole walls and no blurs; the stencil surface has good quality, first class brightness surface, and no pinholes or pittings; the position precision of the opening area of the down step area pattern and the opening area of the electroformed area is high; and the thickness uniformity of the electroformed stencil pattern area is good.

Description

[0001] technical field [0002] The invention relates to a mixed manufacturing process of a stepped template, which belongs to the field of material manufacturing and processing, and in particular to a printing surface in the field of PCB manufacturing that has a down step area, and the plane area and the down step area are both A manufacturing process of a mask plate for printing with pattern openings. [0003] Background technique [0004] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first...

AI Technical Summary

Problems solved by technology

However, the opening size and quality of the steel mold made by the traditional process through laser cutting technology cannot meet the requirements, and the quality of the board surface is not good enough.

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