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Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same

A technology of epoxy resin and electronic components, which is applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., and can solve the adverse effects of characteristics, adverse effects of equipment performance, and the large impact of epoxy resin composition tablets on the shelf life and other problems, to achieve the effect of reducing warpage, good storage stability, and excellent storage stability

Inactive Publication Date: 2013-06-19
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is known that these phosphonium borate-based curing accelerators decompose during the reaction to generate outgassing, and the outgassing components generated may cause voids in molded products, and these outgassing components may adhere to electronic devices. surface of the component, therefore, in some electronic equipment, there are concerns about adverse effects on its characteristics
[0004] Especially in the case of an epoxy resin composition sheet for encapsulation made by coating a varnish for forming the sheet, since the raw material needs to be temporarily made into a varnish state, the pot life of the epoxy resin composition sheet is limited. Great impact
From the viewpoint of the pot life, tetraphenylphosphonium tetraphenylborate can be used, but there is a concern that outgassing may adversely affect device performance (refer to Patent Document 4)

Method used

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  • Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same
  • Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same
  • Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~10

[0122] Embodiment 1~10, comparative example 1~6

[0123] Preparation of sheet-like epoxy resin composition

[0124] The components shown in Tables 1 to 2 described later were dispersed and mixed at the ratios shown in the tables, and methyl ethyl ketone in the same amount as the total amount of the components was added thereto to prepare a coating varnish.

[0125] Next, the above-mentioned varnish was coated on the release-treated surface of a polyester film (manufactured by Mitsubishi Plastics Corporation, MRF-38) with a thickness of 38 μm using a comma coater, and dried to form a sheet-shaped ring with a thickness of 50 μm. A resin layer formed of an oxygen resin composition.

[0126] Next, the peeling-processed surface of the polyester film prepared separately was bonded to the said resin layer (sheet-shaped epoxy resin composition), and it wound up. Then, while peeling off the polyester film appropriately, 12 sheets of the above-mentioned sheet-like epoxy resin comp...

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Abstract

The invention provides a sheet-shaped epoxy resin composition for encapsulating electronic components and an electronic component device using the same, wherein the storage stability is good, and the gas output during the solidification can be reduced. The composition is the sheet-shaped epoxy resin composition for encapsulating the electronic components, and the thickness of the sheet is in a range from 150(mu)m to 1mm. the epoxy resin composition comprises the following (A) to (D) composition, and the following (E)composition. (A) is the epoxy resin, (B) is the phenolic resin, (C) is the elastomer, (D) is the inorganic filler. The (E) is at least one of the following 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(1), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(2), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(3).

Description

technical field [0001] The present invention relates to an epoxy resin composition for encapsulating a chip-shaped electronic component, which can reduce the generation of outgassing during curing and has excellent room-temperature storage stability, and an electronic component device using the same. Background technique [0002] Conventionally, electronic components (electronic devices) represented by various semiconductor elements have been resin-encapsulated and deviceized using a thermosetting resin composition containing epoxy resin as a main component. The above-mentioned thermosetting resin composition usually contains a curing accelerator, and by using the curing accelerator, the thermosetting reaction can be smoothly advanced in a short time. However, as a result of using the above-mentioned curing accelerator, both preservation properties become a problem. Therefore, thermosetting resin compositions usually need to be stored by refrigeration or freezing, and this ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08K3/00C08K5/3445C08K5/32H01L23/29
Inventor 丰田英志石坂刚
Owner NITTO DENKO CORP
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