Pulse jet flow finned cooling device

Abstract

The invention relates to a cooling device of an electron device, in particular to a pulse jet flow finned cooling device which is a high-efficiency cooling device with a pulse jet flow cooling technology and a finned radiator combined. The pulse jet flow finned cooling device mainly comprises a pulsating flow generating device, a jet flow matrix and the finned radiator. The pulse jet flow finned cooling device is characterized in that an electronic signal drives an acoustic excitation device to generate an unsteady pulsating flow which is jetted onto the finned radiator through the pulse jet flow matrix. Due to the fact that cooling media directly impact the finned surface, and a heat transfer process is strengthened through the unsteady pulsating flow, cooling efficiency is improved, energy consumption is reduced, the electronic device with high heat flux density can be effectively and fast cooled, and jet flow parameters can be set according to requirements to adapt working condition changes.

Description

technical field [0001] The invention relates to a cooling system of an electronic device, in particular to a high-efficiency cooling device combined with a jet cooling technology and a fin radiator. Background technique [0002] With the continuous upgrading of integration and miniaturization of electronic devices, their power and integration degree have been greatly improved, and the heat flux density of power devices has been continuously rising. Heat dissipation has become a major obstacle to the further development of the microelectronics industry. Only by adopting appropriate cooling technology and structural design for heat-consuming components of electronic equipment and the whole machine or system, and controlling their temperature rise, can electronic equipment or systems work normally and reliably. For the new generation of electronic equipment, the design constraints and manufacturing techniques of traditional coolers cannot meet the requirements. [0003] Under ...

AI Technical Summary

Problems solved by technology

Finned heat sinks generally cause interference in heat flow and can lead to very high thermal resistance and uneven temperature across the chip surface

In response to the above problems, free ventilation and forced ventilation can be used to reduce the thermal resistance of the radiator, but these methods usually consume a large amount of pump power, and the high heat flux density can generate thermal noise or dark current

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