Capacitive control screen with three-dimensional via hole and manufacturing method thereof

Abstract

The invention discloses a capacitive control screen with a three-dimensional via hole and a manufacturing method thereof. The capacitive control screen comprises a first conducting film layer plated on glass or a PET (polyethylene terephthalate) film, and an insulating layer and a second conducting film layer which are sequentially arranged on the first conducting film layer, the first conducting film layer and the second conducting film layer are provided with corresponding circuits, the insulating layer is provided with a via hole, and a conducting medium used for conducting the circuits is filled in the via hole. According to the capacitive control screen disclosed by the invention, the via hole is manufactured in the insulating layer without damaging the conducting films, so that the manufacturing process of the capacitive control screen is greatly improved.

Description

technical field [0001] The invention relates to the field of capacitive control panels, in particular to a capacitive control panel with three-dimensional via holes and a manufacturing method thereof. Background technique [0002] The structure of the double-sided circuit board is that there is an insulating layer between the upper and lower wire layers, and the via hole is mainly used between the two layers and the wire layer, and plays the role of conducting and connecting the upper and lower wire layers. [0003] The commonly used method of making via holes in the industry is to directly punch holes on double-sided circuit boards, and then inject conductive medium to form via holes. This method is easy to damage the circuit board, especially when the circuit board needs to be bent, the conduction The hole position is prone to brittle fracture. Especially in the process of capacitive control panels with high requirements for thin thickness and precision, it is extremely d...

AI Technical Summary

Problems solved by technology

[0003] The commonly used method of making via holes in the industry is to directly punch holes on double-sided circuit boards, and then inject conductive medium to form via holes. This method is easy to damage the circuit board, especially when the circuit board needs to be bent, the conduction The hole position is prone to brittle fracture

Especially in the process of capacitive control panels with high requirements for thin thickness and precision, it is extremely difficult to use insulating layers to make three-dimensional via holes. At the same time, it is difficult to control the conductive interface, so three-dimensional via holes have not been applied In the process of capacitive control panel

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