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Method and device for encapsulating embedded type sensor system with self-correcting function

A technology for encapsulating devices and sensors, applied to measuring devices, measuring device casings, instruments, etc., can solve problems such as damage, safety monitoring cannot be carried out normally, and achieve good mechanical strength

Inactive Publication Date: 2015-05-27
TAIYUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the safety monitoring of highways, bridges, tunnels, etc. are embedded sensor platforms. When the sensor platform is embedded in the roadbed or structure, it is often squeezed by structural deformation, high temperature, and external impact loads. Damaged by factors, resulting in the failure of normal safety monitoring

Method used

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  • Method and device for encapsulating embedded type sensor system with self-correcting function
  • Method and device for encapsulating embedded type sensor system with self-correcting function
  • Method and device for encapsulating embedded type sensor system with self-correcting function

Examples

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Embodiment Construction

[0026] The following uses the packaging of bridge health monitoring sensors as an example, and introduces the detailed technical solution of the present invention in conjunction with the accompanying drawings. This example is only an embodiment, and the present invention is not limited to this example.

[0027] The bridge health monitoring sensor is an embedded sensor, which is used to measure the temperature and humidity of the working environment inside the bridge, the pressure and tension when the vehicle passes through the road surface, and the change of acceleration caused by vibration when the bridge is subjected to hurricanes and vehicles pass by. Monitor the health of bridges. Bridge health monitoring sensors include temperature, humidity sensors, acceleration sensors, tension sensors and pressure sensors, all of which are connected to the circuit board and equipped with wireless transmission devices.

[0028] Such as figure 1 As shown, the packaging mainly includes t...

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Abstract

The invention discloses a method for encapsulating an embedded type sensor system with self-correcting function; the method comprises two steps including internal encapsulation and external encapsulation, wherein the internal encapsulation comprises the steps of: encapsulating a sensor in a base and an upper cover, building a spherical shape by asphalt or cement, and putting the product into an encapsulation outer shell; and the external encapsulation can be completed by sealing the encapsulation outer shell. The encapsulated sensor system is in the spherical shape, and the centre of gravity of the sensor system is arranged at the bottom of the whole structure, so that the encapsulated sensor is at the beast monitoring position in the encapsulation outer shell all the time under the action of a counter weight screw rod, and the detection position of the sensor can be automatically corrected; and high temperature-resistant brittle material is adopted by external encapsulation and can be crushed when being extruded by the external force, so that the spherical structure obtained by the internal encapsulation can be completely blended with the monitored environment.

Description

technical field [0001] The invention relates to a sensor packaging method, in particular to a packaging method of an embedded sensor system with a self-correcting function. Background technique [0002] The safety monitoring of highways, bridges, tunnels, etc. is an important means to ensure their safe operation. At present, most of the safety monitoring of highways, bridges, tunnels, etc. are embedded sensor platforms. When the sensor platform is embedded in the roadbed or structure, it is often squeezed by structural deformation, high temperature, and external impact loads. Damaged by other factors, resulting in the failure of normal safety monitoring. Therefore, it is very important to properly package the embedded sensor platform so that it can still maintain a normal working state after being embedded in the object under test. Contents of the invention [0003] Aiming at the above problems existing in the current embedded sensors, the present invention discloses an ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01D11/00G01D11/24
Inventor 李朋伟郝惠敏李刚许成龙连崑张文栋桑胜波胡杰
Owner TAIYUAN UNIV OF TECH
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