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Method and structure of light emitting diode (LED) packaging

A technology of LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low air tightness, affecting service life, aging of silica gel, etc., and achieve good air tightness, strong adhesion, The effect of improving stability and reliability

Inactive Publication Date: 2013-06-05
SHENZHEN REFOND OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Silicone encapsulation is usually to cover the molten liquid silicone directly on the LED chip through a glue dispenser, etc., and then form a solid package on the LED chip after cooling and hardening. However, since the bracket is usually metal or ceramic material, silicone The combination between the material package and the bracket is not very tight, and the airtightness between the two is not high; in addition, when in use, the light and heat generated by the LED chip, especially the ultraviolet light generated by the ultraviolet LED chip Exposure to light will cause the aging of silica gel and affect the overall service life

Method used

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  • Method and structure of light emitting diode (LED) packaging
  • Method and structure of light emitting diode (LED) packaging
  • Method and structure of light emitting diode (LED) packaging

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] see figure 1 and figure 2 , figure 1 It is a flow chart of the LED encapsulation method of the present invention, figure 2 for figure 1 A schematic diagram of the LED structure 100 obtained by the method shown. Such as figure 1 As shown, the LED packaging method of the present invention mainly includes the following steps:

[0021] providing a bracket 10 and forming a metal layer 12 on the bracket 10;

[0022] providing a lens 30 and forming a metal layer 32 on the lens 30;

[0023] Install the lens 30 on the support 10 and carry out the die-bonding combination of the support 10 an...

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Abstract

The invention relates to a method of light emitting diode (LED) packaging. The method of LED packaging comprises the following steps: supplying a support and forming a mental layer on the support, wherein an LED chip is arranged on the support, and the metal layer is formed outside the LED chip; supplying a lens and forming a mental layer on the lens, wherein the position of the mental layer of the lens corresponds to the position of the mental layer of the support; installing the lens on the support to enable the mental layer of the support and the mental layer of the lens to take place an eutectic reaction, so that the lens and the support are combined in a whole. The formed LED structure comprises the support, the LED chip and the lens, wherein a circuit is formed on the support, the LED chip is fixed on the support and connected with the circuit of the support in an electrical property mode, and the lens is arranged on the LED chip and connected with the support. A eutectic alloy layer is formed at the position of the support and the lens connecting to connect the lens with the support into a whole in a non-removable mode. The LED structure is strong in adhesive strength and good in air impermeability, and stability and reliability of the LED structure can be effectively improved.

Description

technical field [0001] The present invention relates to LEDs, in particular to an LED packaging method and an LED structure obtained therefrom. Background technique [0002] Light Emitting Diode (LED) is gradually replacing traditional lamps due to its long life, energy saving, and environmental protection, and is widely used in transportation, advertising, landscape, lighting and other fields. [0003] The existing LED structure usually places one or more LED chips on the bracket, and forms an electrical connection with the electrodes on the bracket by wire bonding, and then uses silica gel to package the LED chips to avoid external water vapor or dust from affecting the LED. Chip safety and service life. Silicone encapsulation is usually to cover the molten liquid silicone directly on the LED chip through a glue dispenser, etc., and then form a solid package on the LED chip after cooling and hardening. However, since the bracket is usually metal or ceramic material, silic...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/58H01L33/54
Inventor 陈勘慧许常青
Owner SHENZHEN REFOND OPTOELECTRONICS
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