Multi-chip integrated E-band transmitting module

A multi-chip integration and transmission module technology, applied in electrical components, transmission systems, etc., can solve the problems of complex system circuits, large volume, and low integration of millimeter-wave modules, and achieve good port performance, high integration, and compact structure Effect

Inactive Publication Date: 2013-05-22
SOUTHEAST UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

It realizes the up-conversion function from E-band to X-band in one module, which can overcome the disadvanta

Method used

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  • Multi-chip integrated E-band transmitting module
  • Multi-chip integrated E-band transmitting module
  • Multi-chip integrated E-band transmitting module

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Embodiment Construction

[0027] Below in conjunction with specific embodiment, further illustrate the present invention, should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various equivalent forms of the present invention All modifications fall within the scope defined by the appended claims of the present application.

[0028] like figure 2 , image 3 , Figure 4 and Figure 5 As shown, this embodiment includes a metal upper base 61 and a metal lower base 62, and the cavity formed by the metal upper base 61 and the metal lower base 62 is respectively provided with an SMA to microstrip transition 1 and an intermediate frequency low-pass filter circuit 2, The first circuit for short; the local oscillator circuit, including a local oscillator amplifier chip 4, a microstrip waveguide transition structure 42, a mi...

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Abstract

The invention discloses a multi-chip integrated E-band transmitting module which comprises an upper metal base and a lower metal base. A medium-frequency low-pass filter circuit, a local oscillator circuit and an up-conversion circuit are respectively disposed in a cavity formed by the upper metal base and the lower metal base. A standard SMA (shape memory alloy) connector is arranged at a medium-frequency input end. A local oscillator input end is in a standard waveguide flange structure. A radiofrequency output end is in a standard waveguide flange structure. Signal coupling between a waveguide and a microstrip circuit in the module is achieved through a transition structure, and a low-loss substrate circuit and functional gallium arsenide chips are electrically connected by gold wire bonding. The multi-chip integrated E-band transmitting module based on multi-chip integration technology has the advantages of compact structure, high integrity, low cost, high uniformity and convenience in large-scale manufacturing.

Description

technical field [0001] The invention relates to the technical field of wireless communication, in particular to a multi-chip integrated E-band transmitting module. Background technique [0002] Microwave is a common wireless communication technology. It is widely used in the relay and backhaul of various communication systems due to its long-distance, large capacity, fast deployment, and strong damage resistance. With the continuous mobile broadband bearer demand, conventional microwave spectrum resources from 6GHz to 38GHz have been rapidly exhausted, and it has become an inevitable trend for microwave communication to expand to higher frequency bands. The E-band microwave was released by the International Telecommunications Union Radio Organization (ITU-R) in 2001 and 2003, mainly including 60GHz and 80GHz high-frequency microwave communications. The 60GHz free frequency band was earlier used by the military and industry customers. For business operators, the 80GHz microw...

Claims

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Application Information

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IPC IPC(8): H04B1/04
Inventor 杨非王宗新孟洪福崔铁军孙忠良
Owner SOUTHEAST UNIV
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