Full-automatic wafer dicing saw control system based on vision

Abstract

The invention relates to a full-automatic wafer dicing saw control system based on vision. The full-automatic wafer dicing saw control system based on the vision is matched with a tool device, an optical maser and a micro-camera. Hardware comprises a computer, a motion control card and a displayer, wherein the control card, the displayer, the optical maser and the micro-camera are respectively connected with the computer, motors are respectively connected with the control card through each shaft motion platform and an actuator corresponding to a rotating device, grating sensors are respectively arranged on the motion platform of an axle X and an axle Y and a direct drive motor, and the grating sensors are connected with the computer through an encoder. The computer adopts the Windows system to carry out the modular design based on the VC++. The computer comprises a data processing module, a motion control module, a control system initialization module, a visual inspection locating module, a display interface module and a laser cutting control module. By the technical scheme, the stable operation of the software matching with the hardware of the whole control system is achieved, the control system organically integrates the tool device, the degree of the automatic control is high, and the scribing efficiency is improved by 20% or so compared with the original scribing system.

Description

technical field [0001] The invention relates to a vision-based full-automatic wafer dicing machine control system. Background technique [0002] With the advent of the information age, my country's electronic information, communications and semiconductor inheritance circuits and other industries have developed rapidly, and my country has become the world's largest manufacturer of diode wafers, thyristor wafers and other integrated circuits and various semiconductor wafers. The traditional rotary grinding wheel wafer cutting technology is affected by the process limit in actual production. There are mechanical stress, cracking, low processing efficiency and low yield in wafer processing, which greatly limits the development of wafer manufacturing level. . Traditional wafer cutting methods can no longer meet the high-efficiency and high-precision production requirements of wafer products. Therefore, the problems associated with the rotary grinding wheel cutting process canno...

AI Technical Summary

Problems solved by technology

The traditional rotary grinding wheel wafer cutting technology is affected by the process limit in actual production. There are mechanical stress, cracking, low processing efficiency and low yield in wafer processing, which greatly limits the development of wafer manufacturing level.

Traditional wafer cutting methods can no longer meet the high-efficiency and high-precision production requirements of wafer products

Therefore, the problems associated with the rotary grinding wheel cutting process cannot be completely solved by optimizing the process itself. It is urgent to adopt a new processing method to solve the bottleneck of wafer cutting and dicing; It is difficult to meet the reliability and technical performance requirements of electronic device production, but the wafer dicing machine, which is a key equipment in the post-packaging process, has been monopolized by foreign manufacturers for a long time, especially the intelligent high-precision dicing machine, wafer dicing technology Due to foreign monopoly and the high cost of dicing machine equipment, it is of practical significance to develop and develop dicing machine equipment and highly automated control systems with independent intellectual property rights

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