Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Intelligent platform

A computing platform and computing device technology, applied in the fields of instrumentation, computing, electrical and digital data processing, etc., can solve the problem of non-portability of displays and keyboards

Inactive Publication Date: 2013-05-08
ICE COMP
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the docking station approach cannot "robustly" integrate a smart cell phone with a larger display or a larger keyboard
Additionally, external monitors and keyboards are typically non-portable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent platform
  • Intelligent platform
  • Intelligent platform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] figure 1 is a front view of the smart platform 10 according to an embodiment of the present invention. Such as figure 1 As shown, smart platform 10 is a smart chip-based tablet computer that houses a smart chip such as smart chip 200 as shown. In some embodiments, smart chip 200 and smart platform 10 have a brain-and-body relationship (ie, smart chip 200 controls the operation of smart platform 10 when connected to smart platform 10 ).

[0042] The smart platform 10 includes a touch-sensitive display 110 and a battery 160 that can serve as a larger display and backup power source for the smart chip 200 . In addition, the intelligent platform 10 includes a housing 100, a chip socket 140 (at the back of the touch-sensitive display 110, such as figure 1 shown; see also Figure 2a ), the control unit 150 , the chip connector 120 and the external connector 180 . As mentioned above, the chip socket 140 is located behind the display 110 for receiving the smart chip 200 wi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An intelligent platform integrates with an intelligent portable device or intelligent core to provide a dynamic computer that may serve as any of: a pad, a tablet computing device, a netbook computer, and a notebook computer. The operations of the integrated device are determined by the connected intelligent core's CPU architecture and its installed operating system. The intelligent platform includes a housing and a core slot located behind a display for accommodating the intelligent core. A core connector is provided on an inner wall of the core slot for interconnecting with a compatible connector of the inserted intelligent core. A control unit communicates with the intelligent core through signals carried by the connector, refreshes image received on its touch-sensitive display, and sends touch-input commands from the touchable panel of the touch-sensitive display to the intelligent core. The battery on intelligent platform provides backup power to the intelligent core.

Description

[0001] Cross References to Related Applications [0002] This application is related to a) U.S. Provisional Patent Application Serial No. 61 / 363,240, filed July 10, 2010, entitled "XPAD TABLET," and b) filed June 24, 2011, entitled US Nonprovisional Patent Application Serial No. 13 / 168,666 for "Intelligent Platform," and claiming priority therefrom. The disclosures of these patent applications are hereby incorporated by reference in their entirety. [0003] For US designations, this application is a continuation of aforementioned US Patent Application Serial No. 13 / 168,666. technical field [0004] The present invention relates to a dynamic computer, and more particularly, to a novel computing platform ("smart platform") that accommodates a computing chip arrangement ("smart chip") whereby when connected provides Smart chip computing resources. Depending on the central processing unit (CPU) architecture of the connected computing chip and the loaded operating system, the sm...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16
CPCG06F13/00G06F1/1632G06F1/1656
Inventor S-C.程W-H.吴C-M.林
Owner ICE COMP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products