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Anisotropic conductive film, method for producing bonded body, and bonded body

An anisotropic, conductive film technology, applied in the direction of conductive connection, printed circuit manufacturing, conductive adhesive connection, etc., can solve the problem of high connection resistance

Active Publication Date: 2015-09-02
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in this proposed technology, since sufficient curing cannot be caused by short-time press-fitting, there is a problem of high connection resistance.

Method used

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  • Anisotropic conductive film, method for producing bonded body, and bonded body
  • Anisotropic conductive film, method for producing bonded body, and bonded body
  • Anisotropic conductive film, method for producing bonded body, and bonded body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0115]

[0116] -Formation of conductive particle-containing layer-

[0117] 60 parts by mass of phenoxy resin (trade name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.), 35 parts by mass of acrylic resin (trade name: EB-600, manufactured by Daicel Cytec Corporation), silane coupling agent (trade name : KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.) 2 parts by mass, polymerization initiator (trade name: Perhekisa C, 1,1-bis(tert-butylperoxy)cyclohexane, manufactured by NOF Corporation) 1 mass In the binder composed of parts, the particle density is 8,000 / mm 2 Conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed by the method. The dispersed complex was applied to peel-treated PET so that the average thickness after drying was 8 μm, to prepare a conductive particle-containing layer.

[0118] -Production of insulating adhesive layer-

[0119] 60 parts by mass of phenoxy resin (trade name: YP70, manufactured by ...

Embodiment 2

[0137]

[0138] Except that the polymerization initiator (trade name: パヘキサC, 1,1-bis(tert-butylperoxy)cyclohexane, manufactured by NOF Corporation) containing the conductive particle layer in Example 1 was changed to 3 parts by mass. Except that, it carried out similarly to Example 1, and obtained the anisotropic conductive film.

[0139] The same evaluation as in Example 1 was performed. Table 1-1 shows the results.

Embodiment 3

[0141]

[0142] Except that the polymerization initiator (trade name: パヘキサC, 1,1-bis(tert-butylperoxy)cyclohexane, manufactured by NOF Corporation) containing the conductive particle layer in Example 1 was changed to 8 parts by mass. Except that, it carried out similarly to Example 1, and obtained the anisotropic conductive film.

[0143] The same evaluation as in Example 1 was performed. Table 1-1 shows the results.

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Abstract

An anisotropic conductive film for connecting a terminal of a substrate to a terminal of an electronic component in an anisotropic and electrically conductive manner, which comprises an insulating adhesive layer comprising an acrylic resin and a conductive-particle-containing layer comprising conductive particles, an acrylic resin and a polymerization initiator, wherein only the conductive-particle-containing layer, among the insulating adhesive layer and the conductive-particle-containing layer, contains the polymerization initiator.

Description

technical field [0001] The present invention relates to an anisotropic conductive film capable of electrically and mechanically connecting electronic components such as an IC chip and a liquid crystal panel (LCD panel) of a liquid crystal display (LCD), and a method for producing a bonded body using the anisotropic conductive film. A bonded body obtained by this production method. Background technique [0002] Conventionally, as a means of connecting electronic components and substrates, a tape-shaped connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film)) in which a thermosetting resin dispersed with conductive particles is applied to a release film has been used. . [0003] This anisotropic conductive film is mainly used, for example, when connecting a terminal of a flexible printed circuit board (FPC) or an IC chip to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel, and is also used for connecting ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01C08J5/12C08J5/18H01R43/00
CPCH01R4/04H01R13/2414H05K3/323H05K2203/1189C08J5/18H01B5/16H01R11/01
Inventor 大关裕树冢尾怜司石松朋之
Owner DEXERIALS CORP
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