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Solid particle cooling device

A cooling device, solid particle technology, applied in the direction of direct contact heat exchangers, heat exchanger types, lighting and heating equipment, etc., can solve the problems of complex operation and maintenance, low density of fluidized air, low cooling efficiency, etc. To achieve the effect of reduced use cost, reduced demand, and uniform cooling

Inactive Publication Date: 2013-04-17
王岩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the extremely low density of fluidized air, the heat taken away per unit volume of air is very limited. Fluidized bed coolers usually require a large amount of fluidized air, and correspondingly require high-power fluidized fans, resulting in huge energy consumption and low cooling efficiency.
When using a plate cooler, it is first necessary to lift the material to a high place, and the material lifting process needs to consume a certain amount of energy. Secondly, in order to ensure sufficient heat transfer area and time, a large number of cooling plates are required, and the investment in one-time equipment is large; and Granular materials are often mixed with a certain amount of dust, which adheres to the plate as time goes by and more and more will cause the internal blockage of the plate cooler. It needs to be cleaned once in a short service life, and the operation and maintenance are more complicated.
[0006] In summary, the existing solid particle cooling equipment has the problems of high energy consumption, low cooling efficiency, high cost, and inconvenient use

Method used

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Embodiment Construction

[0023] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0024] The invention provides a solid particle cooling device, which includes a fluidized bed cooler, at least one cooling assembly is arranged in the fluidized bed cooler, and the cooling assembly is installed in the upper box of the fluidized bed cooler , above the distribution plate.

[0025] The cooling assembly does not affect the normal fluidization of solid granular materials in the fluidized bed cooler. Based on the fluidized bed cooler, above the distribution plate of the fluidized bed cooler, arrange and install a predetermined number and specifications of cooling components, and make them directly contact with the predetermined fluidized bed layer. Cooling com...

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Abstract

The invention discloses a solid particle cooling device and relates to the technical field of cooling of solid particles. The solid particle cooling device comprises a fluidized bed cooler, wherein the fluidized bed cooler is internally provided with a cooling assembly; and the cooling assembly is arranged in an upper box body of the fluidized bed cooler and above a distribution plate. By using the solid particle cooling device, the cooling efficiency is increased and a cooling effect is improved in many ways; the solid particles are in great and sufficient contact with the cooling assembly when being cooled by fluidized air so that a great deal of heat is taken away by a refrigerant fluid in the cooling assembly; the stopping time difference of different particles in the fluidized bed is reduced due to the existence of the cooling assembly, and the particles are uniformly cooled on the whole; and the problem of dust scabs can be avoided, so that the cooling assembly keeps the optimal cooling efficiency in long-term operation. Compared with the traditional fluidized bed cooler, the solid particle cooling device can be used for reducing the demand of the fluidized air by over 30% on the premise that the same heat is taken away; and compared with the traditional plate cooker, the solid particle cooling device can be used for reducing the equipment height by over 50%.

Description

technical field [0001] The invention relates to the technical field of solid particle cooling, in particular to a solid particle cooling device. Background technique [0002] In industrial production, it is usually necessary to cool the solid particles obtained in a certain section before entering the next section for processing. For example, in the field of urea large particle granulation, it is necessary to cool down the high-temperature urea particles obtained from the granulator to Below 70°C, subsequent processing such as conveying, screening, crushing, etc. is carried out. Therefore, equipment for cooling solid particles has been widely used. There are two types of solid particle cooling equipment widely used at present: one is a fluidized bed cooler based on the principle of air cooling, and the other is a plate cooler using a cooling plate. [0003] Such as figure 1 As shown, the fluidized bed cooler is a horizontal device, mainly composed of a lower box, a distrib...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28C3/16
Inventor 王岩
Owner 王岩
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