Vertical transition structure among three-dimensional multi-chip component boards

Abstract

The invention discloses a transition structure among three-dimensional multi-chip component boards. The transition structure among the three-dimensional multi-chip component boards comprises a three-dimensional component module made of epoxy resin, an upper-layer circuit board sealed in the three-dimensional component module and a lower-layer circuit board sealed in the three-dimensional component module, a metal layer laid on the surface of the three-dimensional component module and a coplanar waveguide sculptured on the metal layer. The upper-layer circuit board is arranged under the lower-layer circuit board in a paralleled mode, and the coplanar waveguide is vertically arranged on the lateral side of the three-dimensional component module and is perpendicular to the upper-layer circuit board and the lower-layer circuit board. The transition structure among the three-dimensional multi-chip component boards is capable of conducting a three-dimensional vertical interconnection on a lateral side of a 3D-Multi Chip Module (MCM), and achieving vertical interconnections among multi-layer circuit boards. Areas of planar circuits are not occupied by the interconnections. Signal transmission has a wide frequency band, little insertion loss, little return loss and a simple structure. Circuit functions of expanding filtering and distributing power and the like are easy to expand on the interconnections arranged on the lateral side. Further, requirements to registration precision of a vertical circuit and a horizontal circuit are not high, accordingly technical implementability is high.

Description

technical field [0001] The invention relates to a vertical transition structure, in particular to a vertical transition structure between three-dimensional multi-chip component boards. Background technique [0002] Three-dimensional multi-chip module (3D-MCM) is a multi-chip module technology developed on the basis of two-dimensional multi-chip module (2D-MCM) technology. Among the 3D-MCMs, stacked 3D-MCM is currently the most widely used one. Its interconnection technologies currently include: wire bonding (or TAB) vertical interconnection technology, thin film metallization vertical interconnection technology, bump (or solder ball) vertical interconnection technology, isolation plate through-hole metallization vertical interconnection technology, etc. However, these technologies are all interconnection technologies made on laminated circuit boards, which need to occupy the area of ​​laminated circuit boards, which restricts the density and assembly efficiency of circuit m...

AI Technical Summary

Problems solved by technology

Its interconnection technologies currently include: wire bonding (or TAB) vertical interconnection technology, thin film metallization vertical interconnection technology, bump (or solder ball) vertical interconnection technology, isolation plate through-hole metallization vertical interconnection technology, etc. However, these technologies are all interconnection technologies made on laminated circuit boards, which need to occupy the area of ​​laminated circuit boards, which restricts the density and assembly efficiency of circuit multi-chip components.

[0003] With the development of encapsulation technology based on epoxy resin and laser forming circuit technology, the circuit is designed on the side of the laminated circuit, but the alignment accuracy of the side circuit and the horizontal circuit has high requirements on the process, and the interconnection characteristics between the boards great influence

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