Electronic tag manufacturing method

Abstract

The invention discloses an electronic tag manufacturing method. The electronic tag manufacturing method includes the steps: (1) dispensing die attach adhesive in a chip mounting area of an electronic tag antenna; (2) mounting an electronic tag chip at the position dispensed with the die attach adhesive in the step (1); (3) performing high-temperature solidification for a semi-finished product obtained in the step (3), enabling the die attach adhesive to be solidified and then firmly fixing the chip on an antenna substrate; (4) carrying out lead bonding for a semi-finished product obtained in the step (3), and welding two pads on the chip and a pad of the electronic tag antenna together by the aid of an ultrasonic welding process; (5) carrying out an adhesive dispensing and filling process for a semi-finished produce obtained in the step (4), and filling epoxy resin filling adhesive into a chip mounting hole to enable the chip and a lead to be enveloped by the epoxy resin filling adhesive; (6) carrying out filling adhesive solidification for a semi-finished product obtained in the step (5), heating by infrared or ultraviolet and solidifying the epoxy resin filling adhesive; and (7) performing subsequent testing, personalizing, numbering and packaging processes for a finished product obtained in the step (6). An electronic tag manufactured by the method can have the advantages of small size, metal resistance and high reliability.

Description

technical field [0001] The invention relates to the field of radio frequency communication and the field of smart labels, in particular to a method for manufacturing an electronic label. Background technique [0002] In recent years, due to the continuous development of radio frequency electronic technology, especially the wide application of radio frequency electronic tags, people's way of life is gradually changing. Common radio frequency electronic tags are divided into two categories: active and passive in terms of power supply; in terms of carrier frequency, there are 125KHz (130KHz) low-frequency bands, 13.56MHz high-frequency bands, 433MHz, 915MHz ultra-high frequency bands , 2.4GHz, 5.8GHz microwave frequency band; the application of electronic tags is ubiquitous, so there are various shapes and products suitable for different application requirements, making people's life more convenient and efficient. [0003] In order to make radio frequency electronic tags more ...

AI Technical Summary

Problems solved by technology

However, the conventional electronic label packaging process determines that the product has poor environmental adaptability, can no longer be used in harsh environments, cannot be impacted by external forces, is not easy to use on metal surfaces, and the size of the electronic label is relatively large. In the case of small size, anti-metal, anti-external impact and UHF electronic tags used in harsh environments, products realized by traditional processes cannot adapt

Images