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Mask plate and processing method thereof

A processing method and a technology of a mask plate, which are applied in metal material coating technology, ion implantation plating, coating, etc., can solve the problems of affecting the service life of the shadow mask, reducing the quality of evaporation, and affecting the use of the shadow mask, so as to improve The effect of processing accuracy and processing efficiency, overcoming dead angle areas, improving utilization rate and film forming rate

Inactive Publication Date: 2013-04-03
南京澄超光电科技有限公司
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Problems solved by technology

On the other hand, if the shielding degree of the shadow mask is reduced by reducing the thickness of the shadow mask, it will affect the service life of the shadow mask, because the shadow mask is too thin and easy to deform, which will affect the use of the shadow mask and reduce the evaporation rate. quality

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  • Mask plate and processing method thereof

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Embodiment Construction

[0019] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, so as to understand the essence of the present invention more clearly and intuitively.

[0020] figure 1 is a schematic diagram of the structure of the mask plate in the embodiment of the present invention.

[0021] refer to figure 1 As shown, the present embodiment provides a mask plate 1, including an ITO contact surface 11 and an evaporation surface 12, on which a plurality of centrally symmetrical evaporation holes 2 are arranged, and the evaporation holes 2 are self-evaporating. The plated surface 12 penetrates to the ITO contact surface 11 . The cross-section of the evaporation hole 2 is stepped, including a first section and a second section coaxially arranged, and the size of the evaporation hole gradually shrinks from the first section to the second section.

[0022] During evaporation, the ITO contact surf...

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Abstract

The invention relates to a mask plate and a processing method thereof. The mask plate comprises an indium tin oxide (ITO) contact surface and an evaporation surface, wherein a plurality of evaporation holes are formed on the evaporation surface; the evaporation holes penetrate through the ITO contact surface from the evaporation surface, and the section of the evaporation holes is in a step shape; the evaporation holes comprise first sections and second sections which are coaxially arranged; the sizes of the evaporation holes are gradually shrunk from the first sections to the second sections. The processing of the evaporation holes is finished through a laser process only, the required secondary detachment and clamping process are saved in the process of processing the evaporation holes through multiple processes, and the mounting error brought by the operation of processing the evaporation holes through multiple processes is avoided, so that the processing precision and processing efficiency of the evaporation holes can be effectively improved, and the production cost of the mask plate is reduced; and the manufacturing cost of an organic light emitting diode (OLED) display screen is reduced, and the mask plate has wide market prospect.

Description

technical field [0001] The invention relates to the technical field of OLED display and illumination, in particular to a mask plate and a processing method thereof. Background technique [0002] Organic electroluminescent devices have many advantages such as self-luminescence, fast response time, wide viewing angle, low cost, simple manufacturing process, good resolution and high brightness, and are considered to be the emerging application technology of the next generation of flat-panel displays. In OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) technology, the mask plate technology in vacuum evaporation is a very important and key technology, and the level of this technology directly affects the quality and manufacturing cost of OLED products. [0003] When applied to evaporation, the mask for evaporation of the traditional process generally adopts the front and back etching process at the same time. Although the opening with a certain taper can be produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/24H01L51/56
Inventor 唐军
Owner 南京澄超光电科技有限公司
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