Method for removing total phosphor by chemical nickel-plating wastewater treatment

Abstract

The invention discloses a method for removing total phosphor by chemical nickel-plating wastewater treatment. The method comprises the following steps: (1), collecting nickel-containing wastewater (hereinafter referred to as wastewater) to a homogenizing pond, and regulating the pH value of the nickel-containing wastewater to 3-4; (2), carrying out strong-alkalinity anion exchange treatment to the wastewater for complexing and destabilizing the treated wastewater; (3), carrying out strong-acidity cation exchange treatment to the wastewater for recycling nickel; (4), adding oxidant o the wastewater; (5), carrying out catalytic oxidation on the wastewater for oxidizing hypo-phosphorous acid and phosphorous acid to orthophosphoric acid, and degrading macromolecule organic complexing agent to micromolecule, so that the macromolecule organic complexing agent loses complexing capacity; (6), carrying out pulse electro-coagulation treatment on the wastewater for reducing emission concentration of the nickel ion; (7), carrying out solid-liquid separating treatment on the wastewater, regulating the pH value, carrying out flocculation so that suspended matter and sludge agglutinate, and are easy to precipitate and separate, and exhausting the liquid supernatant as required by the standard. The method provided by the invention can treat the nickel-containing wastewater to directly reach the national-level emission standard (the concentration of nickel being lower than 0.1 ppm), further can realize recycling the nickel resources and improve the water-treatment economic benefits.

Description

technical field [0001] The present invention particularly relates to a kind of method of electroless nickel-plating waste water treatment and removal total phosphorus, and it is applicable to the anti-corrosion electroplating process such as the anti-corrosion device processing of electron, communication and printed circuit board industry ( Nickel-containing wastewater discharged from PCB), electroplating and other industries, and realize resource recovery and recycling. Background technique [0002] Electroless nickel plating is a surface treatment technology that effectively improves the corrosion resistance and wear resistance of workpieces. It has been widely used in many industries including printed circuit boards (PCB), metal plating and chemical industry. The main components of the existing electroless nickel plating solution are reducing agent sodium hypophosphite and various organic acid complexing agents such as citric acid, lactic acid, malic acid, pH regulator, e...

AI Technical Summary

Problems solved by technology

In addition, there are ion exchange method, adsorption method, electrodialysis method, evaporation concentration method and reverse osmosis method, but the wastewater treated by these methods cannot reach the national first-level discharge standard (nickel ion concentration<0.1ppm), which will cause Environmental pollution and waste of resources

Moreover, the treatment of total phosphorus is more difficult. In addition to hypophosphorous acid and phosphorous acid that need to be oxidized, there are still a large amount of organic complexing agents in the waste liquid. The high COD value also requires a large amount of oxidant consumption, so the added oxidant disperses the power. , often cannot meet the oxidation requirements of hypophosphorous acid and phosphorous acid, so the removal effect is not good

[0004] The industry generally uses Fenton (Fenton reagent) to treat electroless nickel plating wastewater, but its stability is difficult to control, and the drainage cannot meet the standard

The main oxidation in Fenton's reagent is OH free radicals, but due to the difficulty of control, it is impossible to produce continuous and stable oxidation power, and the discharge water usually cannot meet the standard

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