Thermal wind speed sensor encapsulated based on carbon nanotube array

Abstract

The invention discloses a thermal wind speed sensor encapsulated based on a carbon nanotube array, comprising a silicon substrate, four temperature measurers, a heating element, a copper film layer, a carbon nanotube layer, a nickel film layer and a thermal insulating medium layer. The top surface of the silicon substrate is connected with the bottom surface of the copper film layer, the top surface of the copper film layer is connected with the bottom surface of the carbon nanotube layer, and the top surface of the carbon nanotube layer is connected with the bottom surface of the nickel film layer; the heating element and the four temperature measurers are embedded on the bottom surface of the silicon substrate respectively, the four temperature measurers are uniformly distributed at the periphery of the heating element, and an annular thermal isolation groove is arranged between the heating element and the temperature measurers, and the distance from the top surface of the thermal isolation groove to the top surface of the silicon substrate is smaller than 50 nanometers; and the thermal insulating medium layer is covered on the outer surface of the silicon substrate, the carbon nanotube layer is formed by carbon nanotubes which are arranged in arrays, and each carbon nanotube is vertically arranged. The thermal wind speed sensor of the structure can reduce the influence of the transverse heat conduction of the silicon substrate, and the flexibility of the sensor is improved.

Description

Technical field [0001] The present invention relates to a hot wind speed sensor, in particular to a hot wind speed sensor based on carbon nanotube array packaging. Background technique [0002] Hot wind speed sensors are widely used in the measurement of wind speed and wind direction. With the gradual increase in natural disasters at home and abroad in recent years, the requirements for meteorological monitoring are getting higher and higher, so the realization of high sensitivity hot wind speed sensors is of great significance . In the traditional inverted package structure hot air velocity sensor, two methods are generally used to realize the packaging of the chip and the substrate: the first is to use flip-chip soldering technology, and the second is to directly use thermally conductive glue to glue the chip and the substrate together. Realize encapsulation. However, these two methods have some shortcomings that cannot be ignored. Among them, flip-chip bonding technology can...

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Problems solved by technology

However, these two methods have some disadvantages that cannot be ignored. Among them, the flip-chip technology cannot realize the final package, and the sensitive area of ​​the chip is exposed to the air, so additional protection measures are still required; the second method uses thermal conductive adhesive for direct bonding It is also difficult to avoid the negative impact on the sensitivity of the sensor due to the non-uniformity of the glue and its lateral heat transfer.

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