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Soldering flux

A flux and organic acid activator technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of unsuitable solder joint density and small solder joint volume, and achieve no irritating smell, Spread evenly, non-flammable effect

Inactive Publication Date: 2013-02-06
邸园园
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, considering its limitations in electrical conduction and heat conduction, it is not suitable for packaging fields with high solder joint density and small solder joint volume.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A soldering flux containing, by weight percent:

[0020] Rosin 12%, rosin is the composition of hydrogenated rosin and water-white rosin;

[0021] A mixture of glutaric acid and o-fluorobenzoic acid 3% as an organic acid activator;

[0022] Alkylphenol polyoxyethylene ether 0.7%, as surfactant;

[0023] Amino acid ester 0.2%, as a film-forming agent;

[0024] Octanol 0.1%, as a defoamer;

[0025] P-phenol 0.25%, as a stabilizer;

[0026] Benzotriazole 0.3%, as a corrosion inhibitor;

[0027] Hydrogenated castor oil 3%, as a thixotropic agent;

[0028] Hydrazine hydroxycarboxylic acid compound 12%;

[0029] The balance: ethylene glycol, as an organic solvent.

Embodiment 2

[0031] A soldering flux containing, by weight percent:

[0032] Rosin 22%, rosin is the composition of hydrogenated rosin and water-white rosin;

[0033] A mixture of glutaric acid and o-fluorobenzoic acid 4% as an organic acid activator;

[0034] Octylphenol polyoxyethyl ether 0.9%, as a surfactant;

[0035] Amino acid ester 0.6%, as a film-forming agent;

[0036] Octanol 0.5%, as a defoamer;

[0037] P-phenol 0.35%, as a stabilizer;

[0038] Benzotriazole 0.5%, as a corrosion inhibitor;

[0039] Hydrogenated castor oil 4%, as a thixotropic agent;

[0040] Hydrazine hydroxycarboxylic acid compound 12%;

[0041] The balance: ethylene glycol, as an organic solvent.

[0042] The preparation method of above-mentioned two embodiments is:

[0043] (1) Add the organic acid activator and rosin into the organic solvent, heat to 35°C and stir evenly;

[0044] (2) Add corrosion inhibitor, surfactant, thixotropic agent, keep warm and stir to dissolve;

[0045] (3) Add film form...

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PUM

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Abstract

The invention discloses a soldering flux, which contains rosin, an organic acid activator, a surface active agent, a film-forming agent, a defoaming agent, a stabilizer, a corrosion inhibitor, a thixotropic agent, a hydrazine hydroxy carboxylic acid compound and an organic solvent. The soldering flux disclosed by the invention is simple in manufacturing process and has strong wetting power for lead-free solders; by using the soldering flux, solders are uniformly spread, and residues generated after welding are soluble in water; and after the soldering flux is cleaned with water, a printed board is high in insulating resistance. In addition, the soldering flux disclosed by the invention is non-toxic, and has no pungent smell, therefore, the soldering flux is safe in use; the soldering flux basically does not contain VOC (volatile organic compound) substances, therefore, the soldering flux meets the requirements of environmental protection; and the soldering flux is difficult to burn.

Description

technical field [0001] The present invention relates to a flux. Background technique [0002] Chinese patent CN101695794A discloses a halogen-free tin-bismuth-copper solder paste and a preparation method thereof. The tin-bismuth-copper alloy used in the solder paste is 82.5Sn-17Bi-0.5Cu alloy powder with uniform composition, the flux used in the solder paste does not contain halogen, and the soldering temperature is low, which is beneficial to reduce thermal damage to electronic components. However, considering its limitations in electrical conduction and heat conduction, it is not suitable for packaging fields with high solder joint density and small solder joint volume. Contents of the invention [0003] In order to solve the above technical problems, the present invention provides a soldering flux. [0004] In order to achieve the above object, the present invention adopts the following technical solutions. [0005] A soldering flux containing, by weight percent: ...

Claims

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Application Information

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IPC IPC(8): B23K35/362
Inventor 邸园园
Owner 邸园园
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