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Method of controlling copper-film etching process and method of regenerating copper-film etchant composition

A control method and etching solution technology, applied in spectrometry/spectrophotometry/monochromator, semiconductor/solid-state device manufacturing, optical radiation measurement, etc., can solve the problem of difficult real-time analysis and simultaneous real-time automatic analysis of copper film Changes in the composition concentration of the etching solution, the concentration of copper ions, and the inability to obtain the composition of the copper film etching solution in real time, the treatment and management of the composition of the copper film etching solution, etc., to achieve the effects of saving raw materials, saving manufacturing costs, and improving use efficiency

Inactive Publication Date: 2013-01-30
DONGJIN SEMICHEM CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in terms of analysis, it is necessary to adjust the concentration of the sample or pre-treat the sample to suit each analytical instrument, the analysis takes more than 30 minutes, and there is a disadvantage that real-time analysis is difficult
[0008] In order to overcome this shortcoming, the method of using on-line analysis instrument has been proposed recently, but the on-line analysis instrument that proposes at present generally just carries out sampling automatically, can't obtain the copper film etchant composition in use or the copper film etching after use in real time. Therefore, in order to realize the life management of the copper film etching liquid composition and the proper management and regeneration of the copper film etching liquid composition after the service life is exhausted, a method capable of grasping each component in real time is required. The composition and method of applying to the process
In addition, using the previous online analysis method, it is impossible to automatically analyze the concentration change of the composition of the copper film etching solution and the concentration of copper ions dissolved after etching in real time at the same time.

Method used

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  • Method of controlling copper-film etching process and method of regenerating copper-film etchant composition
  • Method of controlling copper-film etching process and method of regenerating copper-film etchant composition
  • Method of controlling copper-film etching process and method of regenerating copper-film etchant composition

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Embodiment 1-3

[0069] In order to evaluate the process suitability of the analysis system that has utilized the near-infrared spectrophotometer, as shown in Table 1 below, the concentration of the following etching solution composition components for copper film etching was changed, and at the same time, using figure 1 The shown copper film etching process control system performs real-time measurement, and the results of the measured component analysis values ​​are listed in Table 1. At this time, the near-infrared absorbance was measured using a 10 mm quartz cell, and the measurement was repeated five times for each sample and averaged.

[0070] Table 1

[0071] composition

salt composition

acid component

ammonium salt

Deionized water

Copper ions*

Concentration measurement range

2~3% by weight

0.2~0.8% by weight

0.2~0.8% by weight

94~97% by weight

0~3,500ppm by weight

correlation coefficient

0.998

0.9999

0.99...

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Abstract

The invention provides a method of controlling copper-film etching process and method of regenerating copper-film etchant composition. The method of controlling copper-film etching process using a near infrared spectrometer comprises: step a, by using the near infrared spectrometer, simultaneously analyzing a concentrate of at least one component and a concentrate of copper ions in the copper-film etchant composition used in a copper-film etching process of manufacturing processes of a liquid crystal display device or a semiconductor device; step b, comparing the composition analysis results with a reference value, and determining the service life of the copper-film etchant composition; and step c, determining results of the service life of the copper-film etchant composition, exchanging the copper-film etchant composition in use if the service life of the copper-film etchant composition is exhausted, and transferring the copper-film etchant composition to a next copper-film etching process if the the service life of the copper-film etchant composition is not exhausted.

Description

technical field [0001] The invention relates to a copper film etching process control method using a near-infrared spectrometer and a regeneration method for a copper film etching liquid composition. In particular, it relates to the use of a near-infrared spectrometer to automatically analyze the concentration change of the composition of the copper film etching solution and the concentration of copper ions dissolved after etching in real-time and simultaneously in the manufacturing process of liquid crystal display devices (LCD) or semiconductor devices. The copper film etching process can be managed efficiently, and the copper film etching process control method and the copper film etching liquid composition regeneration method utilizing near infrared spectrometer can shorten the copper film etching process time and the copper film etching solution composition regeneration time. Background technique [0002] In a semiconductor device, the process of forming metal wiring on...

Claims

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Application Information

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IPC IPC(8): G01N21/35H01L21/306
CPCC23F1/16G01J3/108G01N21/359H01L21/30604H01L22/12
Inventor 洪振燮朴庆浩李期范
Owner DONGJIN SEMICHEM CO LTD
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