Soft and hard combined plate lamination method

Abstract

The invention provides a soft and hard combined plate lamination method which comprises the following steps: firstly, carrying out multibond on each layer of graphic single sheets of the soft and hard combined plate, and carrying out micro-etching and coarsening copper surfaces of the single sheets, and meanwhile forming an organic metal oxide layer on the surfaces of the copper surfaces of the single sheets; secondly, baking the single sheets after multibond; thirdly, laminating the plate in a predetermined positioning mode, wherein a mold, a steel plate, a buffer material, a manufactured plate, a buffer material, a steel plate and a mold are sequentially placed from bottom to top on the laminating plate, and placing serving plates at two sides of a thin plate area of a hard plate of the manufactured plate, so that the surface of the whole manufactured plate is in flush; fourthly, laminating an inner layer single plate, a bonding plate and an outer layer laminating plate under the vacuumized state; and fifthly, removing the serving plates. According to the invention, the serving plates are filled up on a thinner area in the thickness of the plate, thus the thicknesses of integral plate are kept to be consistent as far as possible, and lamination for one time is carried out, and the lack of lamination issue and the resin recession abnormality issue are solved.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, the invention relates to a pressing method of a rigid-flex board that balances the pressure in the hard board area. Background technique [0002] Due to the design requirements of assembly and component packaging, some printed boards need to make at least two areas with inconsistent thicknesses on the same printed board. This design has different thicknesses and increases the difficulty of lamination. If conventional lamination is used, it is easy It brings hidden dangers of interlayer reliability and glue flow control problems. [0003] Specifically, for the lamination of soft and hard boards, it is necessary to stack the hard board single piece (copper clad laminate with patterns), prepreg, soft board single piece, and outer cladding / foil in a certain positioning manner. Finally, it is compressed into a whole process through high temperature and high pr...

AI Technical Summary

Problems solved by technology

Specifically, on the one hand, if the conventional one-time lamination is performed when the plate thickness is inconsistent, it is difficult to grasp the range of thickness difference, and if the grasp is not good or unstable, it is easy to have interlayer voids, and the greater the plate thickness difference, the more obvious

On the other hand, the process is longer if two times of lamination are used, and when the area of ​​the thick plate area is small, the force of the thick plate area is very likely to cause glue flow to exceed the standard; Only 1 board can be laminated in the mold (a conventional board lamination mold can laminate 2-5 boards, and the thickness of the board determines the actual number of stacked boards)

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