Novel focal plane array electrical interconnection process

Abstract

The invention belongs to the technical field of photoelectronic imaging and relates to a novel focal plane array electrical interconnection process which solves the problem of increase of thermal conductance caused by deformation of indium columns during cold welding of a focal plane detector. The focal plane array electrical interconnection process includes the steps: firstly, a photoetching process on a read-out circuit of the focal plane detector; secondly, a metal membrane deposition process, namely depositing a nickel or copper metal membrane and then depositing an indium metal membrane, wherein the nickel or copper metal membrane is thicker than the indium metal membrane; thirdly, a photoresist stripping process on the read-out circuit; fourthly, an indium column reflux balling process on the read-out circuit; fifthly, an electrode manufacturing process on a focal plane chip; and sixthly, a cold welding interconnection process of the focal plane chip and the read-out circuit. Since nickel or copper is used as indium column support and electrical communication metal, the problem of increase of thermal conductance caused by deformation of indium columns during cold welding interconnection is avoided, and performances of the focal plane array detector are improved.

Description

technical field [0001] The invention relates to a novel focal plane array electrical interconnection process, which belongs to the technical field of photoelectric imaging. Background technique [0002] Focal plane arrays are widely used in the research and development of various optoelectronic devices, such as focal plane infrared detectors, ultraviolet detectors and so on. Taking the focal plane infrared detector as an example, it is an infrared detector that works at room temperature, uses the pyroelectric effect to convert long-wave infrared radiation into electrical signals, and realizes scanning thermal imaging. The device is mainly composed of an infrared focal plane detector chip and a flip-chip interconnection of a readout circuit. It is characterized in that the detector chip and the readout circuit chip are prepared separately to optimize their respective performances and then interconnected. The interconnection between the detector chip and the readout circuit ...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of increased thermal conductance caused by the deformation of the indium column during the cold pressure welding process of the focal plane detector, we propose a new type of metal that is electrically connected to the indium column with a metal with higher hardness and lower thermal conductivity. Interconnect process

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