Plasma processing system with airflow limiting mechanism and method using same

Abstract

The invention discloses a plasma processing system with an airflow limiting mechanism, and belongs to the technical field of plasma processing. The plasma processing system comprises an outer frame, electrode plates, gas transmission pipelines, a vacuumizing system and material placement fixtures. The electrode plates, the material placement fixtures and vent holes in the gas transmission pipelines are positioned in a vacuum cavity body formed by the outer frame. Each material placement fixture has a frame-shaped structure, and is positioned between two opposite electrode plates. The gas transmission pipelines are positioned between the material placement fixtures and the electrode plates, and the vent holes of the gas transmission pipelines are opposite to frames of the material placement fixtures. The invention also discloses a plasma processing method. By the plasma processing system with the airflow limiting mechanism, a gas is uniformly distributed between the electrode plates, and is completely ionized to generate uniform a plasma gas, and a processed sample is subjected to plasma processing. The processed sample can be subjected to uniform plasma processing, so that the problem of non-uniformity of the plasma processing is solved, and plasma processing efficiency also can be improved.

Description

technical field [0001] The present invention relates to a plasma processing technology, in particular to a plasma processing system with a gas flow restriction mechanism capable of uniform gas distribution and a method thereof. Background technique [0002] At present, plasma treatment equipment is widely used in plasma cleaning, etching, plasma plating, plasma coating, plasma ashing and surface activation, modification and other occasions. Through its treatment, the wetting ability of the material can be improved, so that various materials can be coated, plated, etc., the adhesion and bonding force can be enhanced, and organic pollutants, oil or grease can be removed at the same time. [0003] However, in the existing plasma processing equipment, there is no gas flow restriction mechanism between all the electrodes, and the gas is not evenly distributed between every two electrodes. The gas can only be partially ionized between the two electrodes, and some The gas is sucke...

AI Technical Summary

Problems solved by technology

[0003] However, in the existing plasma processing equipment, there is no gas flow restriction mechanism between all the electrodes, and the gas is not evenly distributed between every two electrodes. The gas can only be partially ionized between the two electrodes, and some The gas is pumped away by the vacuum pump. Due to the inhomogeneity of the generated plasma gas, the problem of inhomogeneity will also occur during plasma treatment.

At the same time, since the gas can only be partially ionized between the electrodes, the efficiency of plasma generation is low, which also leads to a decrease in the efficiency of plasma treatment.

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