Transduction component with surface-mounted semi-conductive bridge for electric initiating explosive device
A technology for surface encapsulation and electrical pyrotechnics, which is used in weapon accessories, offensive equipment, blasting cylinders, etc. It can solve the hidden dangers of pyrotechnic function reliability, low product qualification rate, poor mechanical strength, etc., and achieve firm and reliable welding strength. , The product has a high pass rate, and the effect of avoiding damage
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Embodiment 1
[0026] Embodiment 1: A surface-mounted semiconductor bridge transducing element used for electrical explosive products, including electrode plug 1, foot wire electrodes of the electrode plug, printed circuit board 4, and printed circuit board 4 in contact with electrode plug 1 One side is the B side, and the other side is the A side. Two pad electrodes are respectively symmetrically arranged on the two sides of the printed circuit board 4, and three conductive electrodes for connecting the chip are left on the third pad electrode 11 of the B side. The third pad electrode marker 13 of the glue, on the fourth pad electrode 12 of the B side, there are three fourth pad electrode markers 14 of the conductive glue for connecting the chip, which are arranged on the printed circuit board 4 Two electrode holes for passing through the leg electrode of the electrode plug, the electrode hole of the first leg electrode 2 of the electrode plug passes through the first pad electrode 6 of the ...
Embodiment 2
[0027]Embodiment 2: A surface-mounted semiconductor bridge transducing element used for electrical explosive products, including electrode plug 1, foot wire electrodes of the electrode plug, printed circuit board 4, and printed circuit board 4 in contact with electrode plug 1 One side is the B side, and the other side is the A side. Two pad electrodes are symmetrically arranged on the two sides of the printed circuit board 4 respectively, and five pad electrodes 11 for connecting chips are left on the B side. The mark Yu 13 of the third pad electrode conductive glue, five fourth pad electrode mark Yu 14 of the conductive glue used to connect the chip is left on the fourth pad electrode 12 of the B side, on the printed circuit board 4 There are two electrode holes for passing through the leg electrodes of the electrode plug, and the electrode holes of the first leg electrode 2 of the electrode plug pass through the first pad electrodes 6 and B of the A side of the printed circui...
Embodiment 3
[0028] Embodiment 3: A surface-mounted semiconductor bridge transducing element for electrical explosive products, including an electrode plug 1, a leg electrode of the electrode plug, a printed circuit board 4, and a printed circuit board 4 in contact with the electrode plug 1 One side is the B side, and the other side is the A side. Two pad electrodes are arranged symmetrically on the two sides of the printed circuit board 4, and eight pad electrodes 11 for connecting chips are left on the B side. The mark Yu 13 of the third pad electrode conductive glue, on the fourth pad electrode 12 of the B side, there are eight fourth pad electrode mark Yu 14 for connecting the conductive glue of the chip, on the printed circuit board 4 There are two electrode holes for passing through the leg electrodes of the electrode plug, and the electrode holes of the first leg electrode 2 of the electrode plug pass through the first pad electrodes 6 and B of the A side of the printed circuit board...
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