Method for improving exchange bias field heat stability of ferromagnetic/antiferromagnetic dual-layer membrane by laser annealing
A thermally stable, antiferromagnetic technology, applied in the manufacture/processing of electromagnetic devices, etc., to achieve remarkable effects, easy operation, and simple process
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Embodiment 1
[0013] Example 1: A buffer layer Ta with a thickness of 5nm, a CoFe ferromagnetic layer with a thickness of 5nm, an IrMn antiferromagnetic layer with a thickness of 12nm, and an IrMn antiferromagnetic layer with a thickness of 8nm were deposited on the cleaned single crystal silicon substrate by high vacuum magnetron sputtering equipment. Protective layer Ta; wherein, the growth condition of the ferromagnetic / antiferromagnetic double layer film is: background vacuum 5×10 -6 Pa; sputtering pressure 0.3Pa; sputtering power 30W; argon flow rate 20sccm; A plane-induced magnetic field of 300Oe is applied in the plane direction, and the process parameters of laser rapid annealing are: output power 6W, scanning speed 10cm / s. The thermal stability of the exchange bias field of the CoFe / IrMn bilayer film after laser rapid annealing is significantly improved.
Embodiment 2
[0014] Example 2 : Using high vacuum magnetron sputtering equipment to deposit a buffer layer Ta with a thickness of 5nm, a NiFe ferromagnetic layer with a thickness of 5nm, an IrMn antiferromagnetic layer with a thickness of 10nm, and a thickness of 8nm on a cleaned single crystal silicon substrate protective layer Ta; wherein, the growth condition of the ferromagnetic / antiferromagnetic bilayer film is: background vacuum 5×10 -6 Pa; sputtering pressure 0.3Pa; sputtering power 30W; argon flow rate 20sccm; A plane-induced magnetic field of 100Oe is applied in the direction of , and the process parameters of laser rapid annealing are: output power 2W, scanning speed 5cm / s. The thermal stability of the exchange bias field of the NiFe / IrMn bilayer film after rapid laser annealing is significantly improved.
Embodiment 3
[0015] Example 3: A buffer layer Ta with a thickness of 5 nm, a Co ferromagnetic layer with a thickness of 5 nm, an IrMn antiferromagnetic layer with a thickness of 15 nm, and a Co Protective layer Ta; wherein, the growth condition of the ferromagnetic / antiferromagnetic double layer film is: background vacuum 5×10 -6 Pa; sputtering pressure 0.3Pa; sputtering power 30W; argon flow rate 20sccm; A plane-induced magnetic field of 500Oe is applied in the plane direction, and the process parameters of laser rapid annealing are: output power 10W, scanning speed 20cm / s. The thermal stability of the exchange bias field of the Co / IrMn bilayer film after rapid laser annealing is significantly improved.
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