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Nano-scale insulation board and manufacturing method thereof

A production method and nano-scale technology, applied in the direction of insulation improvement, manufacturing tools, building components, etc., can solve the problems of easy cracking of thermal insulation materials, poor fireproof performance and thermal insulation performance of thermal insulation materials, etc., and achieve good shading performance and convenience Good construction and barrier properties

Active Publication Date: 2014-04-02
王胜怀
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a nano-scale thermal insulation board and its manufacturing method, to solve the technical problems of poor fireproof performance and thermal insulation performance of the existing thermal insulation materials; and to solve the technical problem that the thermal insulation materials are easy to crack

Method used

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  • Nano-scale insulation board and manufacturing method thereof
  • Nano-scale insulation board and manufacturing method thereof
  • Nano-scale insulation board and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0042] Embodiment one sees figure 1 As shown, this nano-scale thermal insulation board is characterized in that its board body is made of thermal insulation material packed in a packaging bag and vacuum-sealed. The ratio of the raw materials of the thermal insulation material calculated by weight is as follows:

[0043] Wacker nano-scale fumed silica: 70% to 80%;

[0044] Reinforced fiber: 1% to 3%;

[0045] Far-infrared additives: 1% to 3%;

[0046] Silicon carbide: 12% to 18%;

[0047] Desiccant: 0.8%~1.2%;

[0048] Adhesive: 5%~10%;

[0049] Technical parameters of the board: thermal conductivity 0.0026 W / (m K), mass per unit area (surface density) 4.5±0.4kg / m 2 . The size and thickness of the product can be determined according to the needs of the construction site, for example, 300mm×300mm×15mm can be used, and the thickness can be selected from 10mm to 100mm.

[0050] The thermal insulation material (2) can be wrapped in a non-woven fabric (7) first, and then pack...

Embodiment 2

[0066] Embodiment two see figure 2 , it is made of non-woven fabric wrapped with thermal insulation material and vacuum-sealed in a packaging bag. After putting in the thermal insulation material, the non-woven fabric is folded and ironed. The non-woven fabric can be processed by the manufacturer, and the size is determined by the size of the pallet. The production speed of the product is fast, the dust is less, and the operation is convenient. In the fourth production step, the non-woven fabric can be laid in the pallet mold, the material is put into the middle pallet mold, the plate press is started to form the thermal insulation material into a plate shape, and then the non-woven fabric is wrapped and sealed and ironed. ; After the fifth step, the excess powder on the pallet mold can be swept away, and the dust collection method is adopted, and collected into the storage tank for recycling.

Embodiment 3

[0068]

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Abstract

The invention discloses a nano-scale insulation board and a manufacturing method thereof. The board body is manufactured by coating a thermal insulation material in a non-woven fabric and packaging the thermal insulation material in a packaging bag in a vacuum seal mode. The thermal insulation material comprises the following raw materials in percentage by weight: 70 to 80 percent of nano-scale fumed silica, 1 to 3 percent of reinforced fiber, 1 to 3 percent of far infrared additive, 12 to 18 percent of silicon carbide, 0.8 to 1.2 percent of drying agent and 5 to 10 percent of adhesive, wherein the heat conductivity coefficient is less than or equal to 0.008W / (m.K). Due to detection, the heat conductivity coefficient of the product is less than 0.008W / (m.K), the heat preservation and heat insulation performances are high, the product is light, the defects that the traditional wall heat preservation building materials have poor fireproof performance, poor heat preservation and heat insulation performances and low crack resistance can be overcome, and the nano-scale insulation board can be widely applied to heat preservation and heat insulation roofs of buildings, outer-wall external thermal insulation and outer-wall internal thermal insulation construction.

Description

Technical field [0001] The invention involves a wall insulation building material and its production method. Background technique [0002] Commonly used wall insulation buildings include polystyrene foam insulation board, polyurethane insulation board, polybenzene -gel powder particles, etc. These insulation materials have poor fire resistance and thermal insulation and heat insulation.Body insulation building materials. Invention content [0003] The purpose of the present invention is to provide a nano -level heating board and its production method. It is necessary to solve the technical problems of existing thermal fire resistance and the lack of thermal insulation and thermal insulation performance; and solve the technical problems of easily cracking thermal insulation materials. [0004] In order to achieve the above goals, the present invention uses the following technical solutions: [0005] A nano -level heating board, which is characterized by the plate body, is made of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04B1/80C04B26/02B28B3/02
CPCY02B80/12Y02A30/242Y02B80/10
Inventor 王胜怀
Owner 王胜怀
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