Silver-plated copper containing paste for solar cell back electrode and method for preparing silver-plated copper containing paste
A technology for solar cells and back electrodes, which is applied to conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. Good welding adhesion
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0025] Embodiment: The formula of the solar cell back electrode containing silver-plated copper paste in Examples 1 to 6 of the present invention is shown in the following table 1:
[0026] Table 1 (unit: weight percentage)
[0027]
[0028] Wherein, the content of silver in the silver-plated copper powder is 2%-60% of the weight of the silver-plated copper powder. The particle size of the silver-plated copper powder is 0.1 micron-30 micron. The silver-plated copper powder is at least one of spherical silver-plated copper powder, flaky silver-plated copper powder and dendritic silver-plated copper powder.
[0029] According to the above formula, the preparation method of the solar cell back electrode containing silver-plated copper paste of the present invention is as follows:
[0030] 1. Preparation of adhesive: mixing ethyl cellulose with a dynamic viscosity of 200CP, ethyl cellulose and diethylene glycol butyl ether with a dynamic viscosity of 300CP in proportion to pr...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com