High-compactness low-temperature cofired ceramic package structure and ceramic material thereof

Abstract

The invention relates to a high-compactness low-temperature cofired ceramic package structure for packaging an electronic element and a high-compactness low-temperature cofired ceramic material thereof. The high-compactness low-temperature cofired ceramic package structure comprises a ceramic base, a silver layer and a metal cover. The ceramic base is made of the high-compactness low-temperature cofired ceramic material. A concave portion is arranged in the ceramic base and used for placing the electronic element, the silver layer is arranged on the top face of a lateral wall of the ceramic base, and a gold thin film is plated on the outer surface of the silver layer and used for jointing with the metal cover, so that the metal cover is arranged above the concave portion and covered on the concave portion. The silver layer is arranged on the top face of the lateral wall of the ceramic base in printing method, difficulty of arranging the silver layer is reduced, and a miniaturization trend of the packaging structure is fit.

Description

technical field [0001] The present invention relates to a low-temperature co-fired ceramic package structure and its low-temperature co-fired ceramic material, in particular to a high-density low-temperature co-fired ceramic package structure and its high-density low-temperature co-fired ceramics for packaging high-order electronic components Material. Background technique [0002] figure 1 is a schematic diagram of a conventional ceramic package structure 100 . Such as figure 1 As shown, the conventional ceramic package structure 100 at least includes: a ceramic base 10 ; a metal ring (kovar ring) 12 ; and a metal cover 14 . [0003] The ceramic base 10 can be used to place an electronic component 16, such as high-order electronic components such as communication electronic components or quartz oscillators. In addition, in order to make the ceramic package structure 100 have good airtightness, manufacturers mostly use gold-plated ceramics on the outer surface. metal rin...

AI Technical Summary

Problems solved by technology

[0009] Another object of the present invention is to overcome the defects of the existing co-fired ceramic packaging structure and its co-fired ceramic materials for packaging electronic components, and provide a new type of high-density low-temperature co-fired co-fired ceramic package for packaging electronic components. The technical problem to be solved is to make the silver layer printed on the upper surface of the side wall of the ceramic base combine with the metal cover at a lower temperature, thereby The ceramic base made of high-density low-temperature co-fired ceramic material can be selected, which is more suitable for practical use

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