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Thermal storage and insulation microcapsule for building material and preparation method thereof

A technology of microcapsules and heat storage, which is applied in the direction of microcapsule preparation, microsphere preparation, chemical instruments and methods, etc., can solve the problems of low mechanical strength of microcapsules, complicated preparation process, poor thermal conductivity, etc., and achieve easy industrial promotion and preparation The effect of simple process and good mechanical strength

Active Publication Date: 2012-10-17
常州汉诺斯生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For example, CN1657587A Chinese invention patent discloses that melamine-modified urea-formaldehyde resin is used to microencapsulate phase-change paraffin wax by in-situ polymerization, which can avoid leakage and overflow of phase-change materials during phase change, but some formaldehyde remains in the product, and the preparation process is complicated
[0006] For example, CN101670256A Chinese invention patent discloses that a certain amount of phase change material is mixed with polymer monomers to prepare microcapsules through interfacial polymerization. In the preparation process, no initiator is needed. The method is relatively simple, but the prepared microcapsules have low mechanical strength. , poor thermal conductivity

Method used

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  • Thermal storage and insulation microcapsule for building material and preparation method thereof
  • Thermal storage and insulation microcapsule for building material and preparation method thereof
  • Thermal storage and insulation microcapsule for building material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0028] The following operations and examples will help to understand the present invention, but do not limit the content of the present invention. The preparation of embodiment 1~4 double-layer microcapsule of the present invention

[0029] Take the organic phase change core material, add a certain amount of 400-800 mesh graphite, and heat together until the core material melts;

[0030] a. Control the temperature at 30~40℃, add bath I (modified core material, toluene diisocyanate, polyethylene glycol mass ratio is 1:0.48~1.11:0.16~0.37) into bath II (distilled water and emulsifier mass ratio Ratio of 1:0.02~0.3), high-speed homogenization at 10000~13000rpm, stirring at 350~500rpm for 0.5~1h, to polymerize the inner wall material.

[0031] b. Add 1% to 1.4% of the total mass of chain extender 1,4-butanediol to a, raise the temperature to 50-60°C, and add bath III (distilled water and diethylenetriamine 1:0.06~ 0.28), keep warm for 1 to 2 hours, and polymerize the outer wall ...

Embodiment 5 Embodiment 1

[0039] Embodiment 5 Embodiment 1 double-layer microcapsule performance test

[0040] 1. Use a Fourier transform infrared spectrometer (Nicolet Company, USA) to test the characteristics of paraffin and paraffin heat storage and heat preservation microcapsules, see figure 1 .

[0041] Depend on figure 1It can be seen that the strong absorption peak at 2917.3cm-1 in curve 1 corresponds to the stretching vibration peak of the C-H bond in the fatty chain, 1467.5cm-1 is the scissor bending vibration absorption peak of CH2, and the absorption peak at 720.7cm-1 is the CH2 The in-plane rocking vibration absorption peak is characterized by having more than 4 CH2 long-chain alkanes. Comparing curve 1, it can be seen that the strong absorption peak at 3305.9cm-1 of curve 2 corresponds to the stretching vibration peak of the secondary amino group N-H, and the absorption peak at 1644.7cm-1 corresponds to the stretching vibration of the carbonyl in polyurea, 1551.9cm-1 The absorption peak...

Embodiment 1

[0051] The coated microcapsules in Example 1 were neatly arranged and had a smooth surface. The microcapsules were broken when the temperature was lower than 30°C, and the microcapsules were bonded when the temperature was higher than 40°C.

[0052] The mechanical strength of the microcapsules prepared at different temperatures was compared by using the pump circulation method. The lower the damage rate, the better the mechanical strength. It is characterized by the damage rate:

[0053] table 3

[0054]

[0055] The results in Table 3 show that outside the range of 30-40°C, even if the temperature changes only slightly, the damage rate increases significantly, and the mechanical strength of the product obtained at 30-40°C is obviously better.

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Abstract

The present invention relates to a thermal storage and insulation microcapsule for a building material and a preparation method thereof. An inner wall material employs toluene diisocyanate and polyethylene glycol as a polymerization monomer, which wraps a core material via interfacial polymerization; and an outer wall material employs toluene diisocyanate, diethylenetriamine, ethanediamine or piperazine as a polymerization monomer, which wraps an inner nuclear shell via interfacial polymerization. Capsule wall of the thermal storage and insulation microcapsule of the invention has advantages of thermosetting property, high mechanical strength, and improved abrasion resistance and durability.

Description

technical field [0001] The invention relates to a preparation technology of heat storage and heat preservation microcapsules and its application in building materials. technical background [0002] Since the energy crisis broke out in the 1970s, the development of renewable energy has attracted more and more attention from all countries, and the research on sustainable energy and renewable materials has become a global hot spot. Thermal energy storage systems can be used to store energy while reducing the impact of energy use on the environment, providing a good solution to the contradiction between energy supply and demand. [0003] Microencapsulation refers to a technology that coats tiny particles with film-forming materials, or embeds them in a homogeneous or heterogeneous matrix to form microcapsules, and endows these microcapsules with new properties. Phase-change material microcapsules use microencapsulation technology to encapsulate phase-change material particles i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06B01J13/16B01J13/20C04B24/28
Inventor 纪俊玲周艳思汪信汪媛马志辉李坚
Owner 常州汉诺斯生物科技有限公司
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