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Light-emitting diode display back plate, manufacturing method and display device for light-emitting diode display back plate

A technology for light emitting diodes and display backplanes is applied in the fields of display devices, light emitting diode display backplanes and manufacturing methods thereof, and can solve the problems of disadvantageous mass production, increased equipment investment, and increased manufacturing cost of light emitting diode display backplanes, etc. The effect of improving the quality of light

Active Publication Date: 2012-10-03
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Mainly utilize 60% CF at present 4 In the environment of CVD (Chemical Vapor Deposition, chemical vapor deposition), the surface of the PDL layer is fluorinated to improve the wetting characteristics of the surface of the PDL layer, but this method needs to increase the investment of equipment and increase the cost of the LED display backplane. Manufacturing cost, not conducive to mass production

Method used

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  • Light-emitting diode display back plate, manufacturing method and display device for light-emitting diode display back plate
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  • Light-emitting diode display back plate, manufacturing method and display device for light-emitting diode display back plate

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Embodiment Construction

[0038] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0039] The embodiments of the present invention aim at fluorinating the surface of the PDL layer in the prior art in order to ensure that the printed droplets smoothly and evenly cover the pixel area defined by the pixel defining layer and prevent the droplets from flowing to adjacent pixel areas. treatment, thereby improving the wetting characteristics of the surface of the PDL layer, but this method needs to increase the investment in equipment, increases the manufacturing cost of the light-emitting diode display backplane, and is not conducive to the problem of mass production. A light-emitting diode display backplane and its The manufacturing method and the display device enable the luminescent material to be flatly spread on the LE...

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Abstract

The invention provides a light-emitting diode display back plate, a manufacturing method and a display device for the light-emitting diode display back plate and belongs to the field of displaying. The manufacturing method for the light-emitting diode display back plate includes steps: forming a transparent and conductive anode on a substrate; forming a pixel area defined by a first pixel defining layer and a second pixel defining layer on the substrate where the anode is formed; injecting light-emitting materials into the pixel area, and forming an light-emitting layer comprising the light-emitting materials; and forming a conductive cathode on the substrate where the light-emitting layer is formed. The second pixel defining layer made of hydrophobic materials is located above the first pixel defining layer made of hydrophilic materials. By the aid of the light-emitting diode display back plate, the manufacturing method and the display device for the light-emitting diode display back plate in the technical scheme, the light-emitting materials can be flatly laid on the light-emitting diode display back plate, and light-emitting quality of the light-emitting diode display back plate is improved.

Description

technical field [0001] The invention relates to the field of display, in particular to a light-emitting diode display backplane, a manufacturing method thereof, and a display device. Background technique [0002] OLED (Organic Light-Emitting Diode, organic light-emitting diode) / PLED (polymer light-emitting diode, polymer light-emitting diode) display backplane is composed of glass substrate, ITO (indium tin oxide, indium tin oxide) anode (Anode), organic Emitting Material Layer (Emitting Material Layer) and Cathode (Cathode), etc., where the thin and transparent ITO anode and metal cathode sandwich the organic light-emitting layer like a sandwich, when the voltage injected into the anode hole (Hole) and When the electrons from the cathode are combined in the organic light emitting layer, the organic material in the organic light emitting layer is excited to emit light. [0003] At present, when preparing a light-emitting diode display backplane, a photoresist is coated on a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V21/002F21Y101/02H10K99/00
CPCH01L27/153H01L27/32H01L51/56H10K59/122H10K59/173H10K71/135H10K50/11H10K71/40H10K71/00
Inventor 姜春生
Owner BOE TECH GRP CO LTD
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