Low-melting point glass powder and manufacturing method thereof

Abstract

The invention provides low-melting point glass powder and a manufacturing method thereof; on a weight basis, the low-melting point glass powder comprises: 20-55% of Bi2O3, 10-30% of B2O3, 5-15% of ZnO, 15-40% of BaO, 0.5-5% of CuO, 0.5-2% of MgO, and 0.2-5% of halide. The low-melting point glass powder does not contain harmful elements of lead, vanadium, thallium, tellurium, and the like, has a low thermal expansion coefficient, good chemical stability, wetability and fluidity. In addition, the low-melting point glass powder has low Bi2O3 content, and thus has low manufacturing cost.

Description

technical field [0001] The invention relates to a low melting point glass powder and a manufacturing method thereof. Background technique [0002] Sealing glass powder is often used for sealing between glass, ceramics and metals. In recent years, with the rapid development of the electronics industry, sealing glass powder has been widely used in the sealing and protection of electronic components and display devices, such as sealing vacuum fluorescent display (VFD), plasma display (PDP) and cathode Radiation tube (CRT) and other vacuum devices. [0003] Traditional sealing glass powders are all lead-zinc (PbO-ZnO) glass powders. Although this glass powder can better meet the sealing requirements of sealed parts such as vacuum devices, lead is harmful to human beings. greater health hazard. For this reason, relevant technical personnel have developed lead-free glass powder. [0004] Such as: the well-known Bi for bonding electronic ceramics 2 o 3 -B 2 o 3 - lead-free ...

AI Technical Summary

Problems solved by technology

However, this lead-free bismuthate glass powder requires a large amount of expensive Bi 2 o 3 , leading to higher manufacturing cost of glass frit

Moreover, there are still toxic elements in this glass powder, such as vanadium, therefore, this lead-free bismuth salt glass powder is still harmful to human health

In addition, the range of the expansion coefficient of the lead-free bismuth salt glass powder is small, and its range is only 70-85×10 -7 / °C, and the minimum value of its expansion coefficient is too large, which leads to a narrow application range of the lead-free bismuth salt glass powder

[0005] Another example: a commonly used B 2 o 3 -BaO-SiO-Bi 2 o 3 Quaternary system lead-free barium borate low-melting glass, although the low-melting glass reduces Bi 2 o 3 The amount of usage, but its use temperature is higher than 550 ° C, when using this low melting point glass to seal parts to be sealed such as vacuum devices, the parts to be sealed are easily damaged due to high sealing temperature

Moreover, the coefficient of thermal expansion of the low-melting glass is 70 to 100×10 -7 / °C, the minimum value of its expansion coefficient is also too large, which limits the scope of use of the lead-free barium borate low-melting point glass

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