Laser packaged glass powder sealing material for photoelectric device packaging

Abstract

The invention discloses a laser packaged glass powder sealing material for photoelectric device packaging, and belongs to the technical field of photoelectric device packaging. The sealing material is a combined material of laser packaged glass powder and high-temperature non-conductive ceramic powder added according to the proportion of 5 to 15%. All elements in the sealing material are easily available, so that the cost is low. The softening point of the packaged glass powder has the temperature of 420 to 450 DEG C and the coefficient of thermal expansion of 75*10 <-7> / DEG C. In the packaging of glass, the selection range of laser heating equipment is wider, the laser packaged glass powder sealing material adapts to various different packaging manners, the cost is lowered, and the efficiency is improved; the added ceramic powder plays a role in supporting frit bands, and the frit bands have relatively low flowability in packaging, the packaged bands are closer to the distribution of the frits in sedimentation, the displacement deformation generated in the frit heating process is easy to control to enable the packaged bands to be regular; the frit bands have no great displacement deformation, no remark air holes exit in the packaged bands, and the erosion of oxygen and moisture is blocked by the effective airtight.

Description

technical field [0001] The invention relates to a glass powder sealing compound used for laser sealing OLED devices, belonging to the technical field of photoelectric device packaging. Background technique [0002] Light-emitting devices have been studied quite a lot in recent years. Organic electroluminescent displays (OLEDs), as a new type of flat-panel displays, have attracted people's attention especially because they have applications and potential applications in many electroluminescent devices. Because of its advantages such as good color contrast, active light emission, wide viewing angle, thinning, fast response and low energy consumption. However, traditional OLEDs, especially the electrodes and organic layers located therein, are prone to performance degradation due to the entry of oxygen and moisture in the surrounding environment into the OLED display, seriously affecting the service life of the OLED. If the electrodes and organic layers within an OLED display ...

AI Technical Summary

Problems solved by technology

Scanning encapsulation, that is, a beam of laser is projected onto the encapsulant on the surface of the part to be sealed, and then the laser beam scans a circle along the contour of the material to melt the encapsulant to complete the sealing; spot encapsulation, that is, conduct at different positions of the packaged device Laser point packaging can finally achieve the desired effect of packaging, but in the actual packaging process, due to slow speed and low efficiency, it is not suitable for batch device processing; matrix laser packaging, that is, adjusting the position of the laser array according to the shape of the packaging outline, is The laser and the laser diode array are completely vertically irradiated on the sealing surface, and the package outline is packaged at the same time, which has the advantages of short heating time, small relative displacement during heating, small thermal deformation, and suitable for mass production.

However, so far, there is no one in the industry that can well solve the stress cracks in the process and the surface elastic displacement of the glass frit caused by laser heating, which makes the distribution of the glass frit uneven, and there are gaps in some places, so that The packaging effect is not good, which seriously affects the airtightness of the packaging, and ultimately affects the service life of the OLED

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