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Method and device for cutting machined object by using laser

A processing object, laser cutting technology, applied in glass cutting devices, laser welding equipment, metal processing equipment, etc., can solve the problems of inability to apply fine cutting, focus pollution, etc.

Inactive Publication Date: 2012-10-03
SUZHOU DELPHI LASER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, for this cutting method, due to CO 2 Due to the limitations of the focusing properties of the laser itself (the minimum focus spot diameter must be greater than its wavelength), thermal diffusion caused by high power, and pollution during cooling, this cutting method can only be applied to the cutting of ordinary large-format glass. It cannot be applied to the fine cutting of glass with functional areas on the surface, such as wafers with glass substrates

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  • Method and device for cutting machined object by using laser
  • Method and device for cutting machined object by using laser
  • Method and device for cutting machined object by using laser

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Embodiment Construction

[0059] Embodiments of the laser cutting method of the present invention will now be further explained with reference to the schematic drawings. Moreover, the implementation apparatus of the laser cutting method of this invention is also schematically shown in the drawing of this specification.

[0060] figure 1 A schematic diagram of the optical path and system for implementing the laser cutting method of the present invention is shown. As an exemplary illustration, such as figure 1 As shown, the overall optical path system for implementing the laser cutting method of the present invention can be composed of three parts. The first part is emitted by the first laser source 1, the laser beam L1 is expanded and collimated by the laser beam expander 3, reflected by the laser mirror 10, enters the laser focusing mirror 11, and focuses on the inside of the object 12 to be processed. At this time, in a certain area near the laser focus inside the object 12, physical damage can occ...

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Abstract

The invention relates to a method for cutting a machined object by using laser, which comprises the following steps of: providing at least two laser beams, wherein the two laser beams comprises a first laser beam and a second laser beam; focusing the first laser beam inside the machined object, and producing an internal stress layer inside the machined object by means of the action of the first laser beam on the machined object; focusing the second laser beam on the surface of the machined object, and producing an surface stress layer on the surface of the machined object by means of the action of the second laser beam on the machined object; and at least partially utilizing the superposition of stresses released by the internal stress layer and the surface stress layer, so that the machined object is at least partially fractured and further segmented. The invention also relates to a device for cutting the machined object by using the method.

Description

technical field [0001] The present invention relates to a method of cutting an object to be processed by laser. More specifically, the present invention relates to using at least two laser beams to focus on the inside and surface of the object to be processed to form at least two stress layers, and using the superimposed stress released by the stress layer to cause the object to be processed to break and then be divided. Laser processing method. The invention also relates to a device for carrying out the method. Background technique [0002] Cutting an object to be processed with a laser is already a common process in the field of laser processing. The traditional laser cutting method is to focus the laser on the surface of the object. When the material damage threshold is lower than the laser power density, the object will undergo physical or chemical changes such as melting, gasification, ionization, and repetition. When the power of the laser used is large enough, the ...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/14B23K26/42C03B33/02B28D1/22B23K26/38B23K26/70
Inventor 赵裕兴郭良徐海宾潘传鹏
Owner SUZHOU DELPHI LASER
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