Heat pipe vacuum liquid filling and degassing method and equipment adopting same

Abstract

The invention relates to a heat pipe vacuum liquid filling and degassing method and equipment adopting the same. The heat pipe vacuum liquid filling and degassing equipment includes a vacuum system, a perfusing system, a heating module and a sealing die, wherein an electromagnetic valve is arranged in the middle of an action pipeline; the action pipeline is divided into an upper cavity and a lower cavity through the electromagnetic valve; the vacuum system is connected with the upper cavity of the action pipeline through a vacuum electromagnetic valve; the perfusing system is connected with the lower cavity of the action pipeline through a micro needle valve; the sealing die is arranged adjacent to the orifice of the to-be-processed heat pipe; and the heating module is arranged at the tail part of the to-be-processed heat pipe. According to the heat pipe vacuum liquid filling and degassing method, the to-be-processed heat pipe internally provided with a capillary structure sequentially vacuumizes, perfuses the working medium and separates the remaining non condensable gas. The heat pipe vacuum liquid filling and degassing method and equipment have simple and easy technical means, high production efficiency and high working medium filling precision, and save metal materials.

Description

technical field [0001] The invention relates to the technical field of heat pipe filling with working medium and removal of non-condensable gas in a vacuum environment, in particular to a heat pipe vacuum liquid filling and degassing method and equipment thereof. Background technique [0002] With the rapid development of IC manufacturing technology, the number of transistors integrated on a single chip has reached hundreds of millions, the power consumption and chip connection density are getting higher and higher, and the heat dissipation area is small, which makes the heat flux density increase sharply and the chip temperature rise significantly. Affect its working reliability and service life. Therefore, micro heat pipes with the characteristics of high thermal conductivity, high reliability, fast thermal response, and no need for additional electric drive have become ideal heat conduction components commonly used in the fields of aviation and optoelectronics. [0003] ...

AI Technical Summary

Problems solved by technology

The disadvantage is that it is greatly affected by the environment, and there will be loss of working fluid, and the copper pipe needs to reserve a certain length as the gas-gathering section to cut off, wasting metal materials

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