Surface-mounted fuser

Abstract

A surface-mounted fuse comprises a fusing chip (1). The fusing chip mainly consists of terminal electrodes (2), a ceramic substrate (3), a fusing body layer (4), and an arc extinction glass layer (5). The fusing body layer is located on an upper surface of the ceramic substrate. The two terminal electrodes are located on two sides of the fusing body layer respectively, and are electrically connected to the fusing body layer. The arc extinction glass layer covers the fusing body layer and the regions, close to the arc extinction glass layer, of the terminal electrodes. The surface-mounted fuse further comprises a fuse body (7) having a round through hole (6) in the middle. The fusing chip is located in the round through hole of the fuse body. Two metal covers (8) are located at two ends of the fuse body respectively, and cover the round through hole to form an enclosed chamber. The terminal electrodes are electrically connected to the metal covers through solder lugs (9). The surface-mounted can endure high temperature, has high strength, and can wrap a fuse wire and the arc extinction glass therein. The overall strength, the breaking capability, and the resistance to cold and hot shocks of the fuse are improved, and mass production is convenient.

Description

technical field [0001] The invention relates to the technical field of fuses, in particular to a high-voltage, high-reliability surface mount fuse. Background technique [0002] Surface mount fuses are mainly used for overcurrent protection of printed circuit boards and other circuits. The principle is that when the circuit fails or is abnormal, the metal melt of the fuse itself will fuse and cut off the current to protect the circuit. [0003] Existing surface mount fuses and their manufacture include: fuses made by monolithic technology, fuses made by chip resistance technology and fuses with metal wires in the insulator. The monolithic process is to print one or more layers of melt on the ceramic green substrate through a thick film, and then cut it horizontally and vertically to form a green body of a single element, and then obtain it through co-firing, sealing and electroplating. Its advantages Its glass ceramics have strong arc extinguishing ability, so it can achiev...

AI Technical Summary

Problems solved by technology

The monolithic process is to print one or more layers of melt on the ceramic green substrate through a thick film, and then cut it horizontally and vertically to form a green body of a single element, and then obtain it through co-firing, sealing and electroplating. Its advantages Its glass ceramics have strong arc extinguishing ability, so it can achieve a large breaking capacity. The disadvantage is that its production cycle is long, and there is a risk of mutual penetration when the fuse and the green body are co-fired, resulting in poor consistency; The resistance process is a very mature process. The basic process is to first provide an insulating substrate with front and back sides. There are horizontal and vertical grooves on the substrate, so as to divide the substrate into multiple rectangular units, and then each The surface electrode, the back electrode, the melt and the protective layer covering the melt are respectively formed on the unit, the substrate is divided into multiple substrates along the longitudinal groove, and the terminal internal electrodes are formed on the two sides of each substrate. Finally, each substrate is divided into multiple rectangular units according to the transverse grooves to obtain the required chips. The advantages are simple manufacturing process, short production cycle, and mass production. The disadvantage is that it cannot be used in high-voltage, high-voltage applications. In the reliability environment; the fuse that wears a metal wire in the insulator is the most common way to pass the fuse into the cavity of the ceramic body and then connect to the terminal electrode. The advantage is that the fuse has a large breaking capacity and consistency. Well, the disadvantage is that the fuse is small and easy to break, the wire threading process is complicated, the efficiency is low, it is difficult to produce in large quantities, and the shape of the fuse can be designed limited

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