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Surface-mounted fuser

A surface mount, fuse technology, applied in the high-voltage field, can solve the problems of limited fuse shape design, difficulty in mass production, small and easily broken fuses, etc. Short cycle time and good welding reliability

Active Publication Date: 2012-09-12
SEMITEL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The monolithic process is to print one or more layers of melt on the ceramic green substrate through a thick film, and then cut it horizontally and vertically to form a green body of a single element, and then obtain it through co-firing, sealing and electroplating. Its advantages Its glass ceramics have strong arc extinguishing ability, so it can achieve a large breaking capacity. The disadvantage is that its production cycle is long, and there is a risk of mutual penetration when the fuse and the green body are co-fired, resulting in poor consistency; The resistance process is a very mature process. The basic process is to first provide an insulating substrate with front and back sides. There are horizontal and vertical grooves on the substrate, so as to divide the substrate into multiple rectangular units, and then each The surface electrode, the back electrode, the melt and the protective layer covering the melt are respectively formed on the unit, the substrate is divided into multiple substrates along the longitudinal groove, and the terminal internal electrodes are formed on the two sides of each substrate. Finally, each substrate is divided into multiple rectangular units according to the transverse grooves to obtain the required chips. The advantages are simple manufacturing process, short production cycle, and mass production. The disadvantage is that it cannot be used in high-voltage, high-voltage applications. In the reliability environment; the fuse that wears a metal wire in the insulator is the most common way to pass the fuse into the cavity of the ceramic body and then connect to the terminal electrode. The advantage is that the fuse has a large breaking capacity and consistency. Well, the disadvantage is that the fuse is small and easy to break, the wire threading process is complicated, the efficiency is low, it is difficult to produce in large quantities, and the shape of the fuse can be designed limited

Method used

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Examples

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Embodiment

[0036] Example: A surface mount fuse, as attached Figure 1-13 As shown, it includes a fuse chip 1. This fuse chip 1 is mainly composed of two terminal electrodes 2, a ceramic substrate 3, a melt layer 4, an arc-extinguishing glass layer 5 and a protective layer 15. The melt layer 4 is located on the ceramic substrate. On the upper surface of the sheet 3, the two terminal electrodes 2 are located on both sides of the melt layer 4 and are electrically connected to the melt layer 4, and the arc-extinguishing glass layer 5 covers the melt layer 4 and the terminal electrodes 2 The area near the melt layer also includes a fuse body 7 with a circular through hole 6 in the middle, the fuse chip 1 is located in the circular through hole 6 of the fuse body 7, and two metal covers 8 are respectively located in the Two ends of the fuse body 7 are cut off and the circular through hole 6 is covered to form a closed cavity, and the terminal electrode 2 is electrically connected to the metal...

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Abstract

The invention discloses a surface-mounted fuser, comprising a fusing chip. The fusing chip mainly consists of termination electrodes, a ceramic substrate, a fuse element layer and an arc extinguishing glass layer, wherein the fuse element layer is located on the upper surface of the ceramic substrate; the two termination electrodes are respectively located at the both sides of the fuse element layer and are electrically connected with the fuse element layer; and the arc extinguishing glass layer covers the fuse element layer and the area, which is close to the fuse element layer, of the termination electrodes. The surface-mounted fuser further comprises a fusing main body the middle of which is provided with a round through hole, wherein the fusing chip is located in the round through hole of the fusing main body; two metal covers are respectively located at the both ends of the fusing main body and cover the round through hole so as to form a sealing cavity; and the termination electrodes are electrically connected with the metal covers through welding sheets. The surface-mounted fuser provided by the invention has high temperature resistance and high strength, can coat fusing wires and arc extinguishing glass inside well so as to greatly improve the entire strength, the breaking capability and the thermal shock resistance of the fuser, and is convenient for large-scale production.

Description

technical field [0001] The invention relates to the technical field of fuses, in particular to a high-voltage, high-reliability surface mount fuse. Background technique [0002] Surface mount fuses are mainly used for overcurrent protection of printed circuit boards and other circuits. The principle is that when the circuit fails or is abnormal, the metal melt of the fuse itself will fuse and cut off the current to protect the circuit. [0003] Existing surface mount fuses and their manufacture include: fuses made by monolithic technology, fuses made by chip resistance technology and fuses with metal wires in the insulator. The monolithic process is to print one or more layers of melt on the ceramic green substrate through a thick film, and then cut it horizontally and vertically to form a green body of a single element, and then obtain it through co-firing, sealing and electroplating. Its advantages Its glass ceramics have strong arc extinguishing ability, so it can achiev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H85/041H01H85/05
CPCH01H85/0411H01H2001/5888
Inventor 田伟龚建仇利民杨兆国
Owner SEMITEL ELECTRONICS
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