Refrigeration-type coaxial packaging light-emitting tube core

Abstract

The invention provides a refrigeration-type coaxial packaging light-emitting tube core, which comprises a transistor outline (TO) tube shell, a refrigerator, a heat sink, a laser carrier and a sealing tube cap, wherein the TO tube shell comprises a tube shell base. At least seven pins are arranged around the tube shell base; the pins comprise a radio frequency (RF) signal pin, and the laser carrier with a microstrip line is arranged on the RF signal pin; the radiating surface of the refrigerator and the surface of the tube shell base are fixed in the manner of sticking; the refrigeration surface of the refrigerator and the surface of the heat sink are fixed in the manner of sticking; the heat sink and the surface of the laser carrier with a matched resistor and the microstrip line are fixed in the manner of sticking; an electric absorption modulation laser chip, a backlight detector, a thermistor and a power filter capacitor are fixedly arranged on the surface of the laser carrier in the manner of sticking; one end of the microstrip line of the laser carrier is connected with the anode of an electric absorption modulator; and the other end of the microstrip line of the laser carrier is connected with a microstrip line on the RF signal pin through a conductor wire. When installation is performed, the emitted light outlet optical axis of the laser chip and the optical axis (OA) of the central axis of the TO tube shell are coaxial. Optical steering elements are not needed, the process is simple, and the signal distortion can be reduced.

Description

technical field [0001] The invention relates to a coaxially packaged light emitting tube core for an optical communication system, in particular to a cooling type coaxially packaged light emitting tube core. Background technique [0002] The coaxial package light emission assembly in the prior art includes a coaxial package light emission die and an optical fiber adapter, and the coaxial package light emission die is divided into cooling type and non-cooling type, such as figure 1 The cooling type coaxial packaged light emission die 200 used in the shown US Patent Publication No. US20070159773A1 includes a laser chip 201, a backlight detector 202, a light steering element 203, a carrier 204 containing circuit elements and a cooler 205 Components such as TO-CAN (Transistor Outline-CAN) are installed on the tube base 206, and are sealed by a flat window tube cap 207. In this structure, the laser chip 201 is mounted horizontally on the surface of the carrier 204, and the side ...

AI Technical Summary

Problems solved by technology

The manufacturing process of the cooling type coaxial packaged light emitting die with this structure is complicated, the cost is high, and the optical coupling alignment is difficult, and the modulation signal of the laser is passed between the carrier 204 and the pin 208 at the bottom of the TO-CAN socket 206 The conductive wire 209 is fed in by pressure welding connection. Due to the long conductive wire 209, the modulation signal feed-in circuit has the disadvantage of serious impedance mismatch, which will cause serious signal distortion when transmitting high-speed modulation signals above 2.5Gb / s

Images