Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Highly integrated high light efficiency thermoelectric separation power type light emitting diode (LED) and encapsulating method thereof

A light-emitting diode, thermoelectric separation technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems affecting the reliability of welding between gold wire and bracket, the reliability and life of the chip, and the light decay of the chip. Achieve the effect of good promotion value, low manufacturing cost and simple structure

Inactive Publication Date: 2012-08-22
OUTRACE TECH
View PDF2 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional light-emitting diodes use high-power chips to achieve high brightness. The current high-power diode packaging technology is mainly single-chip high-power packaging. Although it can obtain high luminous flux, it has low luminous efficiency and high heat generation. , the heat generation is concentrated on one chip, which has a great impact on the reliability and life of the chip. At the same time, the thermal channel and the electrical channel of the current light-emitting body diode structure share the same channel, and some designs do not have independent heat conduction. channel, and the electrical channel mainly connects the positive and negative electrodes of the chip with the solder feet of the bracket by bonding gold wires, so the heat emitted by the chip will have a greater thermal impact on the diode circuit structure, affecting the welding of the gold wire and the bracket Reliability, and because there is no independent heat conduction channel, it will also have a great impact on the light decay of the chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Highly integrated high light efficiency thermoelectric separation power type light emitting diode (LED) and encapsulating method thereof
  • Highly integrated high light efficiency thermoelectric separation power type light emitting diode (LED) and encapsulating method thereof
  • Highly integrated high light efficiency thermoelectric separation power type light emitting diode (LED) and encapsulating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] Such as Figure 1 to Figure 5 Shown: a high-integration and high-efficiency thermoelectric separation power type light-emitting diode, the light-emitting diode 3 includes a patch bracket 31, a light-emitting diode chip 32 and a gold wire 33, and the upper surface of the bracket 31 forms a concave The cup 31a, the left and right sides of the bracket 31 are provided with conductive channels 31b, 31c that are independently connected to the two sides of the concave cup 31a, and the bottom surface is provided with a heat conduction channel 31d in the middle leading to the middle of the concave cup 31a, and the light-emitting diode chip 32 passes through The heat-conducting insulating glue 31e is attached to the heat-conducting channel 31d, and its two poles are electrically connected to the conducting channels 31b and 31c through gold wires 33, respectively.

[0047] The light-emitting diode chip 32 includes a parallel connection and each group is composed of at least two lo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a highly integrated high light efficiency thermoelectric separation power type light emitting diode (LED). The LED comprises a paster type bracket, an LED chip and gold threads, wherein a concave cup is formed on the upper surface of the bracket, electric conducting channels which are independently communicated into two sides of the concave cup are arranged at left and right sides of the bracket, the bottom surface of the bracket is provided with a heat conducting channel of which the middle part is communicated to the middle part of the concave cup, the LED chip is stuck with the heat conducting channel through heat conducting insulation paste, two poles of the LED chip are respectively electrically connected with the electric conducting channel through the gold threads, and a fluorescent colloid which is formed by mixing silica gel and fluorescent powder is filled and sealed in the concave cup. Because of the design of thermoelectric separation, heat dissipated when the LED chip works can be independently conducted to a heat dissipating pillar in time, and the impacts of heat on the reliability of second spot welding and the service life of the chip are reduced. With the design of polycrystal serial and parallel integration and thermoelectric separation, the LED disclosed by the invention has the technical effects of high light efficiency, independent heat and electric channels, simple structure, good heat dissipation effect and the like.

Description

technical field [0001] The invention relates to a light-emitting diode, more specifically, to a high-integration and high-efficiency thermoelectric separation power type light-emitting diode. Background technique [0002] With the advancement of electronic technology, the use of LED lighting fixtures is becoming more and more common. Because LEDs emit light using the luminous properties of semiconductors after they are energized, LEDs are green and environmentally friendly light sources with long life, low power, and no radiation, so they are widely used. It is used in backlight, display screen, traffic signal light, urban lighting and other fields. In the future, it will replace incandescent lamp and energy-saving lamp lighting application and become a new generation of lighting source. It is widely used in indoor and outdoor general lighting and special lighting. [0003] Traditional light-emitting diodes use high-power chips to achieve high brightness. The current high-po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L33/62
CPCH01L2924/181H01L2224/32245H01L2224/48137H01L2224/48247H01L2224/49113H01L2224/73265H01L2924/00H01L2924/00012
Inventor 罗嗣辉
Owner OUTRACE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products