Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine
A technology of electrostatic spraying and unit board, which is applied in the direction of coating non-metallic protective layer and secondary treatment of printed circuit, etc., which can solve the problems of easy scratching of the board surface, easy plugging of ink holes, troublesome operation, etc., to avoid material waste, Ease of operation and improvement of production efficiency
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[0025] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0026] See figure 1 , figure 2 , image 3 as shown, figure 1 It is a structural schematic diagram of the framework of the present invention; figure 2 It is a structural schematic diagram of the fixed unit plate in the frame of the present invention; image 3 It is a process flow diagram of the present invention. The invention provides a method for making a solder resist layer of a unit board by an electrostatic spraying machine, which is mainly used to solve the troublesome operation, high cost, high requirements for operators and easy operation of solder resist ink printing using a screen printing screen. Cause the problems of ink rubbing and ink plugging on the surface of the unit board.
[0027] Wherein the method for making the solder resist layer of the unit boar...
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