Film substrate

A thin-film substrate and substrate technology, which is applied in the field of radio frequency communication, can solve the problems of reducing the inductance of the antenna and the inability of the antenna to match the resonant frequency, and achieves the effects of small size, high reliability and good practicability

Inactive Publication Date: 2012-07-25
上海祯显电子科技有限公司
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Problems solved by technology

From the perspective of reducing the size of the RF antenna, after reducing the size of the RF antenna, the inductance of the antenna will decrease, and the length of the antenna cannot match the requirements of the resonance frequency. In the case of matching the input capacitance of the same chip, it is necessary to add an external matching capacitor. In order to reach the resonant frequency of 860-960MHz

Method used

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Embodiment Construction

[0042] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0043] The production process of the thin film substrate of the present invention transplants the miniaturization design idea of ​​the miniaturized monopole antenna to the miniature radio frequency antenna, realizes the miniaturization of the volume of the ultra-high frequency radio frequency device, and obtains a miniaturized, high-reliability ultra- High-frequency radio frequency device products, and then provide technical solutions, the implementation details are as follows:

[0044] see figure 1 , a film substrate provided by the present invention, the dielectric substrate 11 is a thin insulating medium, which is epoxy resin (FR4 or BT), ceramic (LTCC) or Teflon (PTFE) material, and its thickness is between 50 ~ 200um Between, the relati...

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Abstract

The invention discloses a film substrate which is composed of a dielectric substrate, an antenna pattern, a chip and a packaging body, wherein the dielectric substrate is in a square thin-plate structure; the antenna pattern is arranged on the front side and back side of the dielectric substrate and is composed of a signal input bonding pad, an earthing metal surface, a bent fee-in line, a bent Barron line, a spiral micro-strip radiation unit and a through hole; the length of the radiation unit is less than 1/4 of the wavelength of the working frequency of the antenna; and the radiation unit can be applied to a miniaturized radio-frequency circuit.

Description

technical field [0001] The invention relates to the field of radio frequency communication and the field of substrate production, in particular to a thin film substrate. Background technique [0002] In recent years, due to the continuous development of radio frequency electronic technology, especially the wide application of radio frequency electronic tags, people's way of life is gradually changing. Common radio frequency electronic tags are divided into two categories: active and passive in terms of power supply; in terms of carrier frequency, there are 125KHz (130KHz) low-frequency bands, 13.56MHz high-frequency bands, 433MHz, 915MHz ultra-high frequency bands , 2.4GHz, 5.8GHz microwave frequency band; the application of electronic tags is ubiquitous, so there are various shapes and products suitable for different application requirements, making people's life more convenient and efficient. [0003] In order to make radio frequency electronic tags more widely used i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01Q13/08
Inventor 陆红梅
Owner 上海祯显电子科技有限公司
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