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Curable resin composition for optical semiconductor encapsulation, and cured product of same

A technology for curing resins and optical semiconductors, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electro-solid devices, etc. , the effect of high reactivity

Inactive Publication Date: 2012-07-18
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In the case of considering the releasability, under the restriction that silica cannot be filled in the sealing material for optical semiconductor elements, the epoxy resin compositions described in Patent Documents 4 and 5 are the same as Patent Documents 2 and 3, as Sealing materials for optical semiconductor devices cannot meet market demand

Method used

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  • Curable resin composition for optical semiconductor encapsulation, and cured product of same
  • Curable resin composition for optical semiconductor encapsulation, and cured product of same
  • Curable resin composition for optical semiconductor encapsulation, and cured product of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0182] Hereinafter, the present invention will be described in more detail by way of examples. In addition, the present invention is not limited to these Examples. In addition, each measurement result and physical property value in an Example were measured by the following method.

[0183] (gel time test)

[0184] The curable resin compositions obtained in Examples and Comparative Examples were pulverized, and curability at 150° C. was measured by a gel chronometer.

[0185] Gel timing tester: manufactured by IYO Techno Co., Ltd., model 2238-001

[0186] Judgment criteria

[0187] Gel time below 60 seconds: ○

[0188] Gel time more than 60 seconds: ×

[0189] (Hot Hardness Test: Determination of Shore Hardness A)

[0190] The curable resin compositions obtained in Examples and Comparative Examples were subjected to transfer molding, and their hot hardness was measured under the following conditions.

[0191] Hot hardness test conditions

[0192] Mold preheating tempera...

Embodiment 1 to 4、 comparative example 6、7

[0269] Next, the present invention will be described concretely by way of examples.

[0270] The compositions of Examples and Comparative Examples are all in the composition described in the respective tables, using a biaxial kneader, matching the melting temperature of the resin, performing melt kneading, and pulverizing the obtained kneaded product to prepare a transfer molding machine. tablet. Using the obtained ingot, the optical-semiconductor element for a test was produced in the transfer molding machine under the said conditions, and the sample for evaluation was obtained.

[0271] Embodiment 1, 2 and comparative example 6 are shown in table 4, embodiment 3, 4 and comparative example 7 are shown in table 5, embodiment 5 is shown in table 6, and comparative examples 8 and 9 are shown in table 7 .

[0272] In addition, foreign matter and voids in the cured product not described in the table were not observed in any of Examples 1 to 5 of the present invention or in Compa...

preparation example

[0274] When using a substance having a melting point of 150° C. or higher as component (D), it is necessary to dissolve and mix component (D) and component (E) in advance to lower the melting point to below the transfer molding temperature.

[0275] TMEG-600 (melting point 165°C) (D-2) as a multifunctional curing agent component (D) and Rihaya-do GPH-65 (softening point 65°C) (E) as a phenolic curing agent component (E) -1) or YP-90, mix according to the following Table 3.

[0276] Then, the solution was subjected to a vacuum solvent removal process at an oil bath temperature of 150° C. for 2 hours, and finally cooled to room temperature to obtain a resinous solid (masterbatch 1 / MB1 or masterbatch 2 / MB2). As a result of observation with a microscope, no TMEG-600 dissolution residue was observed.

[0277] table 3

[0278]

[0279] *(Note) 1. State after solvent removal: No TMEG-600 dissolved residue

[0280] 2. MEK means methyl ethyl ketone.

[0281] Table 4

[02...

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Abstract

Disclosed is a curable resin composition for optical semiconductor encapsulation which contains: a multi-functional biphenyl novolac epoxy resin component (A); a bisphenol epoxy resin (B) having an epoxy equivalent weight of 500-800g / eq; a bisphenol epoxy resin (C) having an epoxy equivalent weight of 850-1500g / eq; a multi-functional anhydride curing component (D); a phenol curing component (E) having a biphenyl skeleton or an alicyclic skeleton; and a (meth)acrylate component (F) having a phosphoric acid group. During transfer molding the resin composition exhibits excellent reactivity, has a short gel time, and does not include voids; under the high temperatures during mold removal, the resin composition exhibits excellent hardness, and has excellent gate-break properties. Additionally the encapsulated optical semiconductor element which can be obtained using the composition exhibits excellent re-flow properties.

Description

technical field [0001] The present invention relates to a curable resin composition for optical semiconductor sealing. More specifically, it relates to a curable resin composition for sealing an optical semiconductor and an optical semiconductor element sealed by its cured product. The curable resin composition for sealing an optical semiconductor can be produced only by a kneading process, and is suitable for Transfer molding, reactivity and hot hardness, releasability from the mold, prevention of voids, removal of the lead frame from the released runner resin (hereinafter referred to as gate removal (ゲ-トブレイク) process) Excellent, there is no resin leakage from the mold, and after molding and curing, it has excellent resistance to lead-free solder after moisture absorption. Background technique [0002] Conventionally, from the viewpoint of mass productivity, a low-pressure transfer molding method (hereinafter referred to as a transfer molding method) has been employed as a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C08G59/40H01L33/56
CPCH01L2924/0002C08G59/621C08G59/4284H01L33/56H01L2924/00C08G59/20C08G59/40C08L63/00H01L23/29
Inventor 川田义浩枪田正人
Owner NIPPON KAYAKU CO LTD
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