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Method for installing cooling fin of high-power module

An installation method and heat sink technology, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as insufficient heat dissipation of power semiconductors, and achieve the effects of simplifying the production process and improving quality

Inactive Publication Date: 2012-06-27
HANGZHOU SILAN INTEGRATED CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Fully packaged power semiconductors often have the problem of insufficient heat dissipation. During the use of semiconductors, good heat dissipation characteristics and insulation performance are required

Method used

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  • Method for installing cooling fin of high-power module
  • Method for installing cooling fin of high-power module
  • Method for installing cooling fin of high-power module

Examples

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Embodiment Construction

[0035] The present invention will be further described below in conjunction with specific embodiments and accompanying drawings, but the protection scope of the present invention should not be limited thereby.

[0036] The structure after the heat sink is installed in this embodiment, such as image 3 As shown, it includes: a lead frame 6 with a chip, a heat sink 4, and a high thermal conductivity insulating glue 5, and one side of the heat sink 4 is bonded to the base island 11 of the lead frame 6 with the chip 9 through the high thermal conductivity insulation glue 5 the other side of Chip 9 is bonded to base island 11 by means of solder 10 .

[0037] The base island is a part of the lead frame 6 equipped with chips, and the base island is stamped and formed by a mold.

[0038] In the method for installing a heat sink in a module package with a heat sink in this embodiment, first, a lead frame 6 with a chip and a positioning jig 1 need to be prepared. There are positionin...

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Abstract

The invention provides a method for installing a cooling fin of a high-power module. An island of a lead frame is adhered to a cooling fin according to the following steps: enabling a positioning jig to be connected with vacuum; placing the cooling fin in a groove of the positioning jig, and utilizing vacuum to adsorb the cooling fin; arranging high heat-conduction insulating cement on the cooling fin; placing the lead frame where a chip is installed above the positioning jig, and using a positioning hole arranged on the lead frame and a positioning pin arranged on the positioning jig to perform positioning; enabling the back surface of the frame island to coincide with a mucilage glue surface of the cooling fin; and jointly baking the lead frame and the positioning jig, and fully solidifying the high heat-conduction insulating cement which enables the cooling fin to be adhered to the frame island. The method has the advantages of being high in reliability, low in cost, good in heat dissipation effect, little in pollution and the like.

Description

technical field [0001] The invention relates to the packaging technology of high-power modules, in particular to the module packaging technology using cooling fins. Background technique [0002] Fully packaged power semiconductors often have the problem of insufficient heat dissipation. During the use of semiconductors, good heat dissipation characteristics and insulation performance are required. [0003] The trend of semiconductor packaging is miniaturization and modularization. In particular, high-power packaging modules require that the control integrated circuit and power IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) devices be packaged together, which puts forward higher requirements for heat dissipation and insulation characteristics. [0004] Although integrated circuits and other electronic devices have long experienced the need for high speed, high capacity, and high integration, power devices suitable for automobiles, industrial equi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
Inventor 张宏杰
Owner HANGZHOU SILAN INTEGRATED CIRCUIT
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