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Epoxy resin composite wave-absorbing material and preparation method thereof

A composite absorbing material and epoxy resin technology, applied in the field of electromagnetic absorbing materials, can solve the problems of narrow absorbing frequency band, low absorbing efficiency, etc. Effect

Inactive Publication Date: 2013-04-10
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the problems of narrow absorbing frequency band and low absorbing efficiency of existing electromagnetic absorbing materials, one of the purposes of the present invention is to provide an epoxy resin composite absorbing material, which has strong absorbing performance and Wave frequency bandwidth, with good wave transparency and mechanical properties

Method used

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  • Epoxy resin composite wave-absorbing material and preparation method thereof
  • Epoxy resin composite wave-absorbing material and preparation method thereof
  • Epoxy resin composite wave-absorbing material and preparation method thereof

Examples

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Embodiment 1～19

[0032] Examples 1-19 The preparation method of the composite wave-absorbing material is as follows:

[0033] (1) Put epoxy resin E-51 into a three-necked flask, heat and stir in a constant temperature water bath at 60°C, and after the epoxy resin E-51 becomes thinner, add magnetic fillers, conductive fillers and semiconductor fillers into the three-necked flask, Stir in a water bath at 60°C for 10 minutes, and the speed of the mixer is 400 rpm;

[0034] Wherein, the magnetic filler is one or more of nickel ferrite, zinc ferrite, manganese ferrite, zinc-nickel ferrite or zinc-manganese ferrite, and the particle size of the magnetic filler is 3 to 7μm;

[0035] The conductive filler is one or both of carbon fiber or carbon nanotube; the length of carbon fiber is 0.5-6mm, and the outer diameter of carbon nanotube is 5-50nm;

[0036] The semiconductor filler is one or both of aluminum-doped zinc oxide (ZAO) or tin-doped indium oxide (ITO); the particle size of the semiconductor ...

Embodiment 20～27

[0039] Examples 20-27 The preparation method of the composite wave-absorbing material is as follows:

[0040] (1) Put epoxy resin E-51 into a three-necked flask, heat and stir in a constant temperature water bath at 60°C, and after the epoxy resin E-51 becomes thinner, add magnetic fillers and conductive fillers into a three-necked flask, and place in a water bath at 60°C Stir for 10 minutes at a lower speed, and the speed of the mixer is 400 rpm;

[0041] Wherein, the magnetic filler is one or more of nickel ferrite, zinc ferrite, manganese ferrite, zinc-nickel ferrite or zinc-manganese ferrite, and the particle size of the magnetic filler is 3 to 7μm;

[0042] The conductive filler is one or both of carbon fiber or carbon nanotube; the length of carbon fiber is 0.5-6mm, and the outer diameter of carbon nanotube is 5-50nm;

[0043] (2) Put the curing agent into a three-necked flask, add 2 mL of defoamer tributyl phosphate, stir at 500 rpm, stir in a water bath at 60°C for 1...

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Abstract

The invention discloses an epoxy resin composite wave-absorbing material and a preparation method thereof, belonging to the field of electromagnetic wave-absorbing materials. The wave-absorbing material comprises 100 parts by weight of epoxy resin, 50-100 parts by weight of a curing agent, 3-10 parts by weight of a magnetic filling material, 2-6 parts by weight of a semiconductor filling materialand 2-5 parts by weight of a conductive filling material. The preparation method comprises the following steps of: after adding the magnetic filling material, the semiconductor filling material and the conductive filling material into the heated and thinned epoxy resin, uniformly mixing, and curing by adding the curing agent. According to the invention, the semiconductor filling material is composited with the magnetic filling material and the conductive filling material to form the electromagnetic wave-absorbing material to be used, so that the wave-absorbing efficiency of the electromagnetic wave-absorbing material is increased, furthermore, the wave-absorbing frequency band can be effectively broadened.

Description

technical field [0001] The invention relates to an epoxy resin composite wave-absorbing material and a preparation method thereof, belonging to the field of electromagnetic wave-absorbing materials. Background technique [0002] In the era of rapid development of electronics, electrical appliances, communications and information industries, electromagnetic wave interference has become a special environmental pollution. Absorbing materials can reduce or weaken electromagnetic interference, so the research and application of absorbing materials are becoming more and more important. According to the transmission line theory, by improving the conductivity and magnetic permeability of the absorbing material, the impedance of the absorbing material matches the impedance of the free space, and the electromagnetic wave can be greatly incident on the absorbing material and absorbed by attenuation. The absorbing material converts the incident electromagnetic wave into heat energy or ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08K3/22C08K7/06C08K7/00C08K3/04C08G59/50
Inventor 臧充光焦清介王文杰朱祥东张计传
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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