Positioning buckle column and heat dissipating device using the same

A technology of heat dissipation device and positioning buckle, applied in elastic/clamping device, circuit arrangement on support structure, cooling/ventilation/heating transformation, etc., can solve problems such as mistakes made by assemblers

Inactive Publication Date: 2012-05-30
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above solutions are not a long-term solution, and the assemblers will inevitably make mistakes. How to solve the above problems from the design of the heat sink itself is urgently needed at present

Method used

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  • Positioning buckle column and heat dissipating device using the same
  • Positioning buckle column and heat dissipating device using the same
  • Positioning buckle column and heat dissipating device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] As mentioned above, the present invention provides a positioning buckle, which can control the distance that the locking portion of the bottom end protrudes from the bottom surface of the device to be fixed. The implementation details of applying the positioning studs to the heat sink will be described below with reference to the accompanying drawings.

[0055] Please refer to figure 2 , which shows a perspective view of a heat dissipation device according to an embodiment of the present invention. The heat dissipation device 200 has a base plate 204a, a plurality of heat dissipation fins 204b and positioning pins (206a; 206b). The heat dissipation fins 204b and the base plate 204a may be an integrally formed heat dissipation structure of extruded aluminum or other heat dissipation structures of high thermal conductivity materials. The base plate 204a has a through hole through which a plurality of positioning buckle posts (such as the positioning buckle posts 206a, ...

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PUM

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Abstract

The invention discloses a positioning buckle column and a heat dissipating device using the same. The heat dissipating device comprises a substrate and a plurality of positioning buckle columns. The substrate has a plurality of heat radiation fins and a plurality of positioning holes. And the plurality of positioning buckle columns are respectively penetratedly arranged in the positioning holes. Besides, each of the positioning buckle columns includes a round bar, a head, a collar, an elastic component and a clamping part. The round bar has at least two different rod diameters; the head is at one end of the round bar; the collar is nested at a portion that at an connection position of the two different rod diameters and has the smaller rod diameter; and the elastic component is nested at the round bar and is also arranged between the head and the collar. In addition, the substrate is arranged between the elastic component and the collar; and the clamping part is at the other opposite end of the round bar.

Description

technical field [0001] The present invention relates to a positioning buckle post, and in particular to a positioning buckle post used on a heat dissipation device. Background technique [0002] The existing positioning buckle column is assembled on the heat dissipation device, and the distance protruding from the bottom is the original fixed distance of the positioning buckle column, which cannot be adjusted. However, during actual production, there is still a certain distance between the positioning pin and the hole of the printed circuit board. If there is a slight deviation when the positioning buckle is pressed down, it will not be able to press into the hole, and there will be a bottleneck in production. [0003] Please refer to figure 1 , which shows a schematic diagram of a conventional heat dissipation device fixed on a circuit board using positioning posts. The heat dissipation device 100 includes a base plate 104a, heat dissipation fins 104b and positioning pin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/12H05K7/20
Inventor 陈文华
Owner INVENTEC CORP
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