Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low-resistance chip resistor and manufacturing method thereof

A manufacturing method and technology of resistors, which are applied in resistor manufacturing, resistors, thick-film resistors, etc., can solve the problems of increased self-heating of resistors and damage of protective film printed wiring boards, and achieve high-precision manufacturing and enhanced electrical performance. The effect of durability

Active Publication Date: 2015-11-25
KAMAYA ELECTRIC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the self-heating of the resistor increases due to the requirement
In addition, there is a problem that the protective film of the resistor is damaged and the printed wiring board after mounting the resistor is damaged.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-resistance chip resistor and manufacturing method thereof
  • Low-resistance chip resistor and manufacturing method thereof
  • Low-resistance chip resistor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Hereinafter, the structure of the low-resistance chip resistor of this invention is demonstrated.

[0049] figure 1 (a) and (b) are a perspective view and a cross-sectional view of a long strip of an insulating substrate in which alumina powder, which is a type of ceramic powder, is dispersed in an epoxy resin at a volume ratio of 7:3. In these figures, metal plates made of iron-chromium-aluminum alloys, which are strip-shaped with a thickness of 0.05 mm and a width of 6.3 mm, and a length of about several meters, are laminated on several strip-shaped strips with a thickness of 0.3 mm and a width of 4.3 mm. The front and back sides of the substrate 1 of about m. A protective film 3 of epoxy resin with a thickness of about 10 μm is formed by screen printing in the long-dimension direction of the center of the upper and lower sides of the resistive film, and on the resistive layer 2 on both sides of the upper and lower protective film 3 1 and the end surface electrodes ...

Embodiment 1-1）

[0054] image 3 1 to 4 of (a) and (b) represent the above-mentioned Example 1 figure 1 A partial perspective view of the fabrication sequence of a low-resistance chip resistor and its cross-sectional view.

[0055] Figures (a)-1 and (b)-1 are insulating boards 1 in which alumina powder is dispersed and mixed in epoxy resin. The iron-chromium-aluminum alloy metal plate of the upper resistance layer is heated at 150°C to 200°C, and then press-rolled in the range of 2hPa to 3hPa, in (a)-3, (b)-3, and then up and down The above-mentioned epoxy resin is screen-printed in the central part, and baked at a temperature of 150°C to 250°C. In (a)-4 and (b)-4, the two ends are sequentially immersed in a chrome-nickel solution. Thereafter, baking is performed, and finally, as shown in (a)-4, cutting is carried out at intervals of, for example, 3.0 mm to 3.3 mm in width determined by a predetermined resistance value in a cross shape with respect to the longitudinal direction, and complete...

Embodiment 1－2）

[0057] Figure 4 The illustrated embodiment is a modified example of the above (Embodiment 1-1).

[0058] The difference between this embodiment and (Example 1-1) is that when the resistive film 2 is hot-rolled on the insulating substrate 1, the two ends are made stronger than the central part in the width direction, that is, the central part is 1.5hPa Pressure rolling was performed while pressure rolling was performed at 3 hPa on both sides.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided are a low-resistance chip resistor having a simple structure in which self-independence is given and the mechanical strength is increased for durability, and an easier and faster method of manufacturing same.  A low-resistance chip resistor characterized in that resistive layers are formed on both the front and back surfaces of an insulating substrate, or insulating substrates are formed on both the front and back surfaces of a resistive layer, that in the former, protective films are formed on the central portions of the resistive layers in the longitudinal direction and surface and back electrodes are formed on the resistive layers on both sides of the protective films, and in the latter, surface and back electrodes are formed on the resistive layers on both sides of the substrates, and that in both the former and latter, end surface electrodes are provided at both ends in the width direction.

Description

technical field [0001] The present invention relates to a chip resistor, especially a chip resistor of low resistance, and a manufacturing method thereof. Background technique [0002] Recently, chip resistors with low resistance values ​​for current detection are often used to protect multifunctional portable devices from overcurrent. Therefore, in order to detect a larger current value while maintaining the same size and resistance value of the resistor, it is required to increase the rated power. Therefore, due to this requirement, the self-heating of the resistor increases. In addition, there arises a problem in that the protective film of the resistor and the printed wiring board after mounting the resistor are damaged. [0003] Therefore, in Patent Document 1, the resistor 2 is directly thermally diffusion-bonded on the ceramic substrate 1 to enhance the mechanical strength of the component. [0004] In addition, Patent Document 2 discloses that a resistor is integr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01C3/00
CPCH01C7/003H01C1/148H01C17/006H05K1/167H05K3/285H01C3/00H01C17/00
Inventor 松川修平野立树户田笃司
Owner KAMAYA ELECTRIC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com