Plastic product and preparation method for same
A technology for plastic products and plastics, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of high equipment and process requirements, pollution of plastic substrates, high laser energy, and low laser energy requirements. Effect
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[0016] According to one embodiment of the present invention, the present invention provides a kind of preparation method of plastic product, comprises the following steps:
[0017] 1) molding plastic substrate; the plastic substrate is a thermoplastic or thermosetting plastic containing a chemical plating catalyst precursor, and the chemical plating catalyst precursor is evenly distributed in thermoplastic or thermosetting plastic; the chemical plating catalyst precursor is copper, iron, zinc One or more of nitrides, borides or phosphides of tin, nitrides of tin, borides or phosphides of nickel;
[0018] 2) The laser is irradiated on a selected area on the surface of the plastic substrate, the surface plastic in the corresponding area is vaporized, and the exposed chemical plating catalyst precursor is decomposed to obtain the chemical plating catalyst;
[0019] 3) Electroless copper plating on the surface of the electroless plating catalyst obtained in step 2), continue to pe...
Embodiment 1
[0050] (1) PP resin, Cu 3 B 2 , calcium silicate fiber and antioxidant 1010, according to the mass ratio of 100:10:30:0.2, mixed with a high mixer, extruded and pelletized with a twin-screw extruder (Nanjing Rubber and Plastic Machinery Factory), and injection molded into LED Lamp circuit board carrier.
[0051] (2) Use an infrared laser (Tide, DPF-M12) to print metal circuit patterns on the LED lamp circuit board carrier. The laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step size 9μm, delay 30μs, frequency 40KHz , power 3W, filling pitch 50 μm; after the laser irradiation is completed, the surface of the plastic carrier is ultrasonically cleaned.
[0052] (3) immerse in the electroless copper plating solution for 4 hours to form a copper layer with a thickness of 15 μm; then immerse in the electroless nickel plating solution for 10 minutes to form a nickel layer with a thickness of 5 μm; finally flash-plate a 0.03 micron thick gold layer. Among them, e...
Embodiment 2
[0055]Adopt the method identical with embodiment 1 to prepare the plastic product of the present embodiment, difference is:
[0056] In step (1), the Fe 3 P ball milled to an average particle size of 800nm, dried; PEEK resin, Fe 3 P, glass fibers and antioxidant 168 are mixed in a mass ratio of 100:20:30:0.2, extruded and granulated and then injection molded to be an automobile engine electronic connector housing;
[0057] In step (3), the order of electroless plating is: first electroless copper plating for 4 hours to form a 15 μm thick copper layer, then electroless nickel plating for 10 minutes to form a 5 μm thick nickel layer, and finally flash plating a 0.03 μm thick gold layer.
[0058] Through the above steps, the plastic product used as the housing of the electronic connector of the automobile engine in this embodiment is obtained.
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