Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mold release composition and surface protective film

A technology of surface protection film and composition, which is applied in the direction of photoplate making process, coating, instrument, etc. on the patterned surface, and can solve the problems such as the decrease of exposure accuracy

Active Publication Date: 2012-04-11
KIMOTO CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Part of the attached photoresist remains on the photomask even if it is wiped off, causing a problem that the exposure accuracy is lowered

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] The coating solution containing the release composition of the following composition was applied to one surface of a transparent polymer film (LUMIRROR: Toray) with a thickness of 6 μm by the bar coating method, and heated and cured at 120°C for 5 minutes to form A coating film with a thickness of about 0.5μm. Furthermore, the coating liquid for an adhesive layer of the following composition was apply|coated on the other surface, and it dried, and the adhesive layer of thickness about 4 micrometers was formed, and the surface protection film of Example 1 was produced. In order to facilitate the operation, a 25 μm-thick polyethylene terephthalate release film (MRB: Mitsubishi Chemical Polyester Film Co., Ltd.) was attached to the adhesive layer.

[0057]

[0058] ·Binder resin 1.85 parts

[0059] (ES-1002T: Shin-Etsu Chemical Co., Ltd., solid content 60%)

[0060] ·0.05 parts of silicone oil with alkoxy groups at the end

[0061] (X-22-1968: Shin-Etsu Chemical Co., Ltd., solid...

Embodiment 2

[0074] The surface protection film of Example 2 was prepared in the same manner as in Example 1, except that the coating liquid containing the releasable composition used in Example 1 was replaced with the coating liquid containing the releasable composition of the following composition.

[0075]

[0076] ·Binder resin 1.85 parts

[0077] (ES-1002T: Shin-Etsu Chemical Co., Ltd., solid content 60%)

[0078] 0.02 parts of silicone oil with alkoxy groups at the end

[0079] (X-22-1968: Shin-Etsu Chemical Co., Ltd., solid content 100%)

[0080] ·Silanolate condensate 2.22 parts

[0081] (X-40-2308: Shin-Etsu Chemical Co., Ltd., 100% active ingredient)

[0082] ·Curing agent 0.1 part

[0083] (Titanium-based chelate, 100% active ingredient)

[0084] ·Silane coupling agent 0.3 parts

[0085] (100% active ingredients)

[0086] · 9.64 parts of solvent

Embodiment 3

[0088] The surface protection film of Example 3 was prepared in the same manner as in Example 1, except that the coating liquid containing the releasable composition used in Example 1 was replaced with the coating liquid containing the releasable composition of the following composition.

[0089]

[0090] ·Binder resin 1.85 parts

[0091] (ES-1002T: Shin-Etsu Chemical Co., Ltd., solid content 60%)

[0092] 0.19 parts of silicone oil with alkoxy groups at the end

[0093] (X-22-1968: Shin-Etsu Chemical Co., Ltd., solid content 100%)

[0094] ·Silanolate condensate 2.22 parts

[0095] (X-40-2308: Shin-Etsu Chemical Co., Ltd., 100% active ingredient)

[0096] ·Curing agent 0.1 part

[0097] (Titanium chelate, 100% active ingredient)

[0098] ·Silane coupling agent 0.3 parts

[0099] (100% active ingredients)

[0100] · 9.64 parts of solvent

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

Provided is a mold release composition, with which it is possible to form a transparent coating on the surface of which a photoresist cannot be readily deposited. Also provided is a surface protective film having a coating formed from the cured product of the mold release composition. The mold release composition comprises a binder resin, a silicone oil, and a metal alkoxide hydrolysis product. Preferably the metal alkoxide hydrolysis product content is 50 to 500 parts by weight per 100 parts by weight of binder resin. Preferably the metal alkoxide consists of tetraethoxysilane or tetramethoxysilane. The surface protective film is obtained by forming a coating of the cured product of the mold release composition on a substrate.

Description

Technical field [0001] The present invention relates to a release composition and a surface protective film using the same. In particular, it relates to a releasable composition capable of forming a coating film excellent in releasability and mold releasability, and a surface protection film having a coating film containing the cured product. The coating film and the surface protection film of the cured product of the present invention can be formed on the surface of the original (photomask) when the adhesive photoresist is exposed in the printed circuit board production step or the like. Fit and use. Background technique [0002] Generally, a printed circuit board or a resin relief plate is produced by attaching a photomask to an adhesive photoresist such as a liquid photoresist and exposing it. Therefore, if no treatment is applied to the surface of the photomask, part of the photoresist will adhere to the surface of the photomask when the photomask is peeled off from the pho...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08L83/04C09D201/00C09D183/04G03F1/48
CPCC08G77/02C08K5/057C09D183/04G03F7/00C09D183/02Y10T428/265C08L83/00C08L83/04C08L101/00
Inventor 长谷川刚涉谷崇志新井裕之栗岛进
Owner KIMOTO CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com